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Oscillator Frequency
The LTC1430 includes an onboard current controlled
oscillator which will typically free-run at 200kHz. An
internal 20µA current is summed with any current in or out
of the FREQSET pin (pin 11), setting the oscillator fre-
quency to approximately 10kHz/µA. FREQSET is internally
servoed to the LTC1430 reference voltage (1.26V). With
FREQSET floating, the oscillator is biased from the internal
20µA source and runs at 200kHz. Connecting a 50k
resistor from FREQSET to ground will sink an additional
25µA from FREQSET, causing the internal oscillator to run
at approximately 450kHz. Sourcing an external 10µA
current into FREQSET will cut the internal frequency to
100kHz. An internal clamp prevents the oscillator from
running slower than about 50kHz. Tying FREQSET to V
CC
will cause it to run at this minimum speed.
Shutdown
The LTC1430 includes a low power shutdown mode,
controlled by the logic at the SHDN pin. A high at SHDN
allows the part to operate normally. A low level at SHDN
stops all internal switching, pulls COMP and SS to ground
internally and turns M1 and M2 off. In shutdown, the
LTC1430 itself will drop below 1µA quiescent current
typically, although off-state leakage in the external
MOSFETs may cause the total PV
CC
current to be some-
what higher, especially at elevated temperatures. When
SHDN rises again, the LTC1430 will rerun a soft-start cycle
and resume normal operation. Holding the LTC1430 in
shutdown during PV
CC
power up removes any PV
CC1
sequencing constraints.
LAYOUT CONSIDERATIONS
Grounding
Proper grounding is critical for the LTC1430 to obtain
specified output regulation. Extremely high peak currents
(as high as several amps) can flow between the bypass
capacitors and the PV
CC1
, PV
CC2
and PGND pins. These
currents can generate significant voltage differences be-
tween two points that are nominally both “ground.” As a
general rule, GND and PGND should be totally separated
on the layout, and should be brought together at only one
point, right at the LTC1430 GND and PGND pins. This
helps minimize internal ground disturbances in the
LTC1430 by keeping PGND and GND at the same potential,
while preventing excessive current flow from disrupting
the operation of the circuits connected to GND. The PGND
node should be as compact and low impedance as pos-
sible, with the negative terminals of the input and output
capacitors, the source of M2, the LTC1430 PGND node,
the output return and the input supply return all clustered
at one point. Figure 11 is a modified schematic showing
the common connections in a proper layout. Note that at
10A current levels or above, current density in the PC
board itself can become a concern; traces carrying high
currents should be as wide as possible.
Output Voltage Sensing
The LTC1430 provides three pins for sensing the output
voltage: SENSE
+
, SENSE
and FB. SENSE
+
and SENSE
connect to an internal resistor divider which is connected
to FB. To set the output of the LTC1430 to 3.3V, connect
SENSE
+
to the output as near to the load as practical and
connect SENSE
to the common GND/PGND point. Note
that SENSE
is not a true differential input sense input; it
is just the bottom of the internal divider string. Connecting
SENSE
to the ground near the load will not improve load
regulation. For any other output voltage, the SENSE
+
and
SENSE
pins should be floated and an external resistor
string should be connected to FB (Figure 12). As before,
connect the top resistor (R1) to the output as close to the
load as practical and connect the bottom resistor (R2) to
the common GND/PGND point. In both cases, connecting
the top of the resistor divider (either SENSE
+
or R1) close
to the load can significantly improve load regulation by
compensating for any drops in PC traces or hookup wires
between the LTC1430 and the load.
Power Component Hook-Up/Heat Sinking
As current levels rise much above 1A, the power compo-
nents supporting the LTC1430 start to become physically
large (relative to the LTC1430, at least) and can require
special mounting considerations. Input and output ca-
pacitors need to carry high peak currents and must have
low ESR; this mandates that the leads be clipped as short
as possible and PC traces be kept wide and short. The
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Figure 11. Typical Schematic Showing Layout Considerations
V
OUT
R1
NC
NC
R2
LTC1430 • F12
LTC1430
SENSE
+
FB
SENSE
Figure 12. Using External Resistors to Set Output Voltages
+
+
+
LTC1430 • F11
3.3V
2.7µH/15A
TOTAL
1980µF
(330µF
6.3V ×6)
M1A*
M2*
PV
CC1
I
MAX
FREQSET
GND
PGND
SHDN
COMP
NC
SS
PV
CC2
V
CC
PGNDGND
R
C
7.5k
0.1µF
1µF
0.1µF
C
C
4700pF
C1
220pF
C
SS
0.01µF
4.7µF
35V
100
G1
I
FB
G2
FB
SENSE
+
NC
NC
LTC1430
SENSE
GND
PGND
* MOTOROLA MTD20N03HL
1N4148
5V
M1B*
TOTAL
880µF
(220µF
10V ×4)
power inductor will generally be the most massive single
component on the board; it can require a mechanical hold-
down in addition to the solder on its leads, especially if it
is a surface mount type.
The power MOSFETs used require some care to ensure
proper operation and reliability. Depending on the current
levels and required efficiency, the MOSFETs chosen may
be as large as TO-220s or as small as SO-8s. High
efficiency circuits may be able to avoid heat sinking the
power devices, especially with TO-220 type MOSFETs. As
an example, a 90% efficient converter working at a steady
3.3V/10A output will dissipate only (33W/90%) • 10% =
3.7W. The power MOSFETs generally account for the
majority of the power lost in the converter; even assuming
that they consume 100% of the power used by the
converter, that’s only 3.7W spread over two or three
devices. A typical SO-8 MOSFET with a R
ON
suitable to
provide 90% efficiency in this design can commonly
dissipate 2W when soldered to an appropriately sized
piece of copper trace on a PC board. Slightly less efficient
or higher output current designs can often get by with
standing a TO-220 MOSFET straight up in an area with
some airflow; such an arrangement can dissipate as much
as 3W without a heat sink. Designs which must work in
high ambient temperatures or which will be routinely
overloaded will generally fare best with a heat sink.
15
LTC1430
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTIO
U
Dimensions in inches (millimeters) unless otherwise noted.
N8 1098
0.100
(2.54)
BSC
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.130 ± 0.005
(3.302 ± 0.127)
0.020
(0.508)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
0.125
(3.175)
MIN
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325
+0.035
–0.015
+0.889
–0.381
8.255
()
12
3
4
876
5
0.255 ± 0.015*
(6.477 ± 0.381)
0.400*
(10.160)
MAX
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
N16 1098
0.020
(0.508)
MIN
0.125
(3.175)
MIN
0.130 ± 0.005
(3.302 ± 0.127)
0.065
(1.651)
TYP
0.045 – 0.065
(1.143 – 1.651)
0.018 ± 0.003
(0.457 ± 0.076)
0.100
(2.54)
BSC
0.009 – 0.015
(0.229 – 0.381)
0.300 – 0.325
(7.620 – 8.255)
0.325
+0.035
–0.015
+0.889
–0.381
8.255
()
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
0.255 ± 0.015*
(6.477 ± 0.381)
0.770*
(19.558)
MAX
16
1
2
3
4
5
6
7
8
910
11
12
13
14
15
N8 Package
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
N Package
14-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)

LTC1430IS#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Hi Pwr Buck Sw Reg Cntr
Lifecycle:
New from this manufacturer.
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