MP6900- FAST TURN-OFF INTELLIGENT CONTROLLER
MP6900 Rev. 1.13 www.MonolithicPower.com 2
6/23/2014 MPS Proprietary Information. Patent Protected. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2014 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number Package Top Marking
MP6900DJ* TSOT23-5 6D
MP6900DS** SOIC-8 MP6900DS
MP6900DQ*** QFN6 (3x3mm) 5D
* For Tape & Reel, add suffix –Z (e.g. MP6900DJ–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP6900DJ–LF–Z)
** For Tape & Reel, add suffix –Z (e.g. MP6900DS–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP6900DS–LF–Z)
*** For Tape & Reel, add suffix –Z (e.g. MP6900DQ–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP6900DQ–LF–Z)
PACKAGE REFERENCE
TOP VIEW
V
G
V
SS
V
DD
1
2
3
5
4
PGND
V
D
MARKING
PGND
EN
NC
V
D
V
G
NC
V
DD
V
SS
1
2
3
4
8
7
6
5
TOP VIEW
TSOT23-5 SOIC-8 QFN6 (3x3mm)
ABSOLUTE MAXIMUM RATINGS
(2)
V
DD
to V
ss
..................................... -0.3V to +27V
PGND to V
Ss
............................... -0.3V to +0.3V
V
G
to V
SS
......................................... -0.3V to V
CC
V
D
to V
SS
.................................... -0.7V to +180V
EN to V
SS
.................................... -0.3V to +6.5V
Maximum Operating Frequency ............. 400kHz
Continuous Power Dissipation (T
A
= +25°C)
(3)
SOIC8 ...................................................... 1.39W
TSOT23-5 ................................................ 0.57W
QFN6 (3x3mm) .......................................... 2.5W
Junction Temperature .............................. 150°C
Lead Temperature (Solder) ...................... 260°C
Storage Temperature .............. -55°C to +150°C
Recommended Operation Conditions
(4)
V
DD
to V
ss
........................................... 8V to 24V
Operating Junction Temp. (T
J
). ... -40°C to +125°C
Thermal Resistance
(5)
θ
JA
θ
JC
SOIC8 .................................... 90 ...... 45 ... °C/W
TSOT23-5 ............................. 220 .... 110 .. °C/W
QFN6 (3x3mm) ...................... 50 ...... 12 ... °C/W
Notes:
2) Exceeding these ratings may damage the device.
3) The maximum allowable power dissipation is a function of the
maximum junction temperature. T
J
(MAX) the junction-to-
ambient thermal resistance θ
JA
and the ambient temperature
T
A
. The maximum allowable power dissipation at any ambien
temperature is calculated using: P
D
(MAX)=(T
J
(MAX)-T
A
)/ θ
JA
.
Exceeding the maximum allowable power dissipation will
cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
4) The device is not guaranteed to function outside of its
operating conditions.
5) Measured on JESD51-7, 4-layer PCB.
