1/10March 2002
.
STD30NF06
N-CHANNEL 60V - 0.020 - 28A IPAK/DPAK
STripFET™ II POWER MOSFET
TYPICAL R
DS
(on) = 0.020
EXCEPTIONAL dv/dt CAPABILITY
100% AVALANCHE TESTED
THROUGH-HOLE IPAK (TO-251) POWER
PACKAGE IN TUBE (SUFFIX “-1")
SURFACE-MOUNTING DPAK (TO-252)
POWER PACKAGE IN TAPE & REEL
(SUFFIX “T4")
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronis unique "Single Feature Size™" strip-
based process. The resulting transistor shows extremely
high packing density for low on-resistance, rugged
avalanche characteristics and less critical alignment
steps therefore a remarkable manufacturing
reproducibility.
APPLICATIONS
HIGH CURRENT, HIGH SWITCHING SPEED
MOTOR CONTROL , AUDIO AMPLIFIERS
SOLENOID AND RELAY DRIVERS
DC-DC & DC-AC CONVERTERS
TYPE
V
DSS
R
DS(on)
I
D
STD30NF06 60 V <0.028
28 A
3
2
1
1
3
IPAK
TO-251
(Suffix “-1”)
DPAK
TO-252
(Suffix “T4”)
ABSOLUTE MAXIMUM RATINGS
(
•)
Pulse width limited by safe operating area. (1) I
SD
28A, di/dt
300A/µs, V
DD
V
(BR)DSS
, T
j
T
JMAX
(2) Starting T
j
= 25
o
C, I
D
= 15A, V
DD
= 30V
Symbol Parameter Value Unit
V
DS
Drain-source Voltage (V
GS
= 0)
60 V
V
DGR
Drain-gate Voltage (R
GS
= 20 k
)
60 V
V
GS
Gate- source Voltage ± 20 V
I
D
Drain Current (continuous) at T
C
= 25°C
28 A
I
D
Drain Current (continuous) at T
C
= 100°C
20 A
I
DM
(
•)
Drain Current (pulsed) 112 A
P
tot
Total Dissipation at T
C
= 25°C
70 W
Derating Factor 0.47 W/°C
dv/dt
(1)
Peak Diode Recovery voltage slope 10 V/ns
E
AS
(2)
Single Pulse Avalanche Energy 230 mJ
T
stg
Storage Temperature
-55 to 175 °C
T
j
Max. Operating Junction Temperature
INTERNAL SCHEMATIC DIAGRAM
STD30NF06
2/10
THERMAL DATA
ELECTRICAL CHARACTERISTICS (T
case
= 25 °C unless otherwise specified)
OFF
ON
(*)
DYNAMIC
Rthj-case
Rthj-amb
T
l
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
Max
Max
2.14
100
275
°C/W
°C/W
°C
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 µA, V
GS
= 0
60 V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating T
C
= 100°C
1
10
µA
µA
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= ± 20 V
±100 nA
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
I
D
= 250 µA
24V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 10 V I
D
= 15 A
0.020 0.028
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
(*)
Forward Transconductance
V
DS
= 15 V I
D
= 15 A
40 S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25V, f = 1 MHz, V
GS
= 0
1750
220
70
pF
pF
pF
3/10
STD30NF06
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
(*)
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
(
•)Pulse width limited by safe operating area.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Delay Time
Rise Time
V
DD
= 30 V I
D
= 19 A
R
G
= 4.7
V
GS
= 10 V
(Resistive Load, Figure 3)
20
100
ns
ns
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
= 48V I
D
= 38A V
GS
= 10V
43
9.5
15
58 nC
nC
nC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
f
Turn-off Delay Time
Fall Time
V
DD
= 30 V I
D
= 19 A
R
G
= 4.7
Ω,
V
GS
= 10 V
(Resistive Load, Figure 3)
50
20
ns
ns
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
(
)
Source-drain Current
Source-drain Current (pulsed)
28
112
A
A
V
SD
(*)
Forward On Voltage
I
SD
= 28 A V
GS
= 0
1.5 V
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
= 28 A di/dt = 100A/µs
V
DD
= 30 V T
j
= 150°C
(see test circuit, Figure 5)
95
260
5.5
ns
µ
C
A
ELECTRICAL CHARACTERISTICS (continued)
Safe Operating Area
Thermal Impedance

STD30NF06T4

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET N-channel 60 V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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