NCV8613B
http://onsemi.com
4
MAXIMUM RATINGS (Voltages are with respects to GND unless noted otherwise)
Rating
Symbol Max Min Unit
Maximum DC Voltage VIN−B, VIN−A, ASO_RAIL,
VBATT_MON, VIN_S3, EN, IGNIN
40 −0.3 V
Peak Transient VIN−B, VIN−A, ASO_RAIL,
VBATT_MON, VIN_S3, EN, IGNIN
45 −0.3 V
Maximum DC Voltage VIN−H 24 −0.3 V
Maximum DC Voltage IGNOUT, V
PP
, HV_DET, BO_DET,
HOT_FLG, RST, DLY, V
OUT1
, V
OUT2
, V
OUT3
7 −0.3 V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL INFORMATION
Rating Symbol Min Unit
Thermal Characteristic (Note 1)
R
q
JA
40 °C/W
Operating Junction Temperature Range T
J
−40 to 150 °C
Maximum Storage Temperature Range T
STG
−55 to +150 °C
Moisture Sensitivity Level MSL 1
1. Values based on measurement of NCV8613B assembled on 2−layer 1−oz Cu thickness PCB with Copper Area of more than 645 mm
2
with
several thermal vias for improved thermal performance. Refer to CIRCUIT DESCRIPTION section for safe operating area.
ATTRIBUTES
Rating Symbol Min Unit
ESD Capability, Human Body Model (Note 2) ESD
HB
2 kV
ESD Capability, Machine Model (Note 2) ESD
MM
200 V
ESD Capability, Charged Device Model (Note 2) ESD
CDM
1 kV
IGNIN ESD Capability, Human Body Model (Note 2) ESD
HB
_IGNIN 3 kV
IGNIN ESD Capability, Machine Model (Note 2) ESD
MM
_IGNIN 200 V
IGNIN ESD Capability (Note 3) ESD_IGNIN 10 kV
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charged Device Model (CDM) tested per EIA/JES D22/C101, Field Induced Charge Model
3. Device tested with external 10 kW series resistance and 1 nF storage capacitor.