MPX2100
Sensors
Freescale Semiconductor 5
Pressure
On-Chip Temperature Compensation and Calibration
Figure 3 shows the output characteristics of the
MPX2100 series at 25°C. The output is directly proportional
to the differential pressure and is essentially a straight line.
The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating
Characteristics.
Figure 3. Output versus Pressure Differential
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2100 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Output (mVdc)
kPa
PSI
40
35
30
25
15
10
5
0
-5
025
3.62
50
7.25
75
10.87
100
14.5
Offset
(Typ)
20
MAX
TYP
MIN
V
S
= 10 Vdc
T
A
= 25°C
P1 > P2
Span
Range
(Typ)
Silicone Gel
Die Coat
Absolute
Die
P1
Metal Cover
Epoxy
Case
Absolute Element
P2
Lead Frame
Wire Bond
Die
Bond
Stainless Steel
Lead Frame
Wire Bond
Differential/Gauge
Die
Silicone Gel
Die Coat
Differential/Gauge
P2
Die
Bond
Epoxy
Case
Stainless Steel
Metal Cover
P1
Element
