TLP759
2015-11-30
Absolute Maximum Ratings
(Ta = 25°C)
Characteristic Symbol Rating Unit
LED
Forward current I
F
25 mA
Forward current derating (Ta ≥70°C) IF / Ta -0.8 mA / °C
Pulse forward current (Note 1) I
FP
50 mA
Peak transient forward current (Note 2) I
FPT
1 A
Reverse voltage V
R
5 V
Diode power dissipation (Note 3) P
D
45 mW
Detector
Output current I
O
8 mA
Peak output current I
OP
16 mA
Output voltage V
O
−0.5 to 20 V
Supply voltage V
CC
−0.5 to 30 V
Output power dissipation P
O
100 mW
Output power dissipation derating (Ta ≥70°C) Po / Ta -2 mW / °C
Operating temperature range T
opr
−55 to 100 °C
Storage temperature range T
stg
−55 to 125 °C
Lead solder temperature (10 s) (Note 4) T
sol
260 °C
Isolation voltage (AC, 60 s, R.H. ≤ 60%) (Note 5) BV
S
5000 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
(Note 1) 50% duty cycle, 1 ms pulse width. Derate 1.6mA / °C above 70°C.
(Note 2) Pulse width ≤ 1μs, 300pps.
(Note 3) Derate 0.9mW / °C above 70°C.
(Note 4) Soldering portion of lead: Up to 2mm from the body of the device.
(Note 5) Device considered a two terminal device: Pins 1, 2, 3 and 4 shorted together and pins 5, 6, 7 and 8 shorted
together.