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LT3012BEFE#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
13
LT3012B
3012bf
+
ADJ
OUTIN
LT3012B
GND
1µF
3.3µF
750k
V
IN
12V
(LATER 42V)
LOAD: CLOCK,
SECURITY SYSTEM
ETC
+
–
ADJ
OUTIN
LT3012B
GND
1µF
3.3µF
V
IN
48V
(72V TRANSIENT)
LOAD:
SYSTEM MONITOR
ETC
NO PROTECTION
DIODE NEEDED!
NO PROTECTION
DIODE NEEDED!
3012B TA05
BACKUP
BATTERY
249k
750k
249k
LT3012B Automotive Application
LT3012B Telecom Application
Constant Brightness for Indicator LED over Wide Input Voltage Range
IN
LT3012B
1µF
RETURN
–48V
OUT
ADJ
GND
3012B TA06
3.3µF
R
SET
I
LED
= 1.24V/R
SET
–48V CAN VARY FROM –4V TO –80V
TYPICAL APPLICATIO S
U
14
LT3012B
3012bf
U
PACKAGE DESCRIPTIO
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev C)
4.00 ±0.10
(2 SIDES)
3.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 ± 0.05
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
0.25 ± 0.05
3.30 ±0.05
(2 SIDES)
16
127
0.50
BSC
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0905 REV C
0.25 ± 0.05
3.30 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.70 ±0.05
(2 SIDES)2.20 ±0.05
0.50
BSC
0.70 ±0.05
3.60 ±0.05
PACKAGE OUTLINE
15
LT3012B
3012bf
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
FE16 (BB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
134
5
6
7
8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.94
(.116)
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
2.94
(.116)
3.58
(.141)
3.58
(.141)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

LT3012BEFE#PBF

Mfr. #:
Buy LT3012BEFE#PBF
Manufacturer:
Analog Devices / Linear Technology
Description:
LDO Voltage Regulators 80Vin, 250mA. LDO in TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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