MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Professional
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Vishay Beyschlag
Revision: 12-Feb-16
11
Document Number: 28766
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TESTS PROCEDURES AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
• EN 60115-1, generic specification (includes tests)
• EN 140100, sectional specification (includes schedule for
qualification approval)
• EN 140101-806 (successor of CECC 40101-806), detail
specification (includes schedule for conformance
inspection)
The test and requirements table contains only the most
important tests. For the full test schedule refer to the
documents listed above.
The tests are carried out in accordance with IEC 60068-2-xx
test method and under standard atmospheric conditions in
accordance with IEC 60068-1, 5.3.
Climatic category LCT / UCT / 56 (rated temperature range:
lower category temperature, upper category temperature;
damp heat, steady state, test duration: 56 days) is valid.
Unless otherwise specified the following values apply:
• Temperature: 15 °C to 35 °C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For performing some of the tests, the components are
mounted on a test board in accordance with IEC 60115-1,
4.31.
In Test Procedures and Requirements table, only the tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods.
A short description of the test procedure is also given.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE CHANGE
(R max.)
Stability for product types:
STABILITY
CLASS 0.5
STABILITY
CLASS 1
STABILITY
CLASS 2
MBA/SMA 0204 1 to 332 k 0.22 to < 1 > 332 k
MBB/SMA 0207 1 to 1 M 0.22 to < 1 > 1 M
MBE/SMA 0414 1 to 2.43 M 0.22 to < 1 > 2.43 M
4.5 - Resistance - ± 5 % R; ± 1 % R; ± 0.5 % R
4.7 - Voltage proof U
RMS
= U
ins
; 60 s No flashover or breakdown
4.8 -
Temperature
coefficient
At (20 / -55 / 20) °C
and (20 / 155 / 20) °C
± 50 ppm/K; ± 25 ppm/K
4.13 -
Short time
overload
Room temperature;
U= 2.5x or
U = 2xU
max.
; 5 s
± (0.1 %R +0.01 )
no visible damage
± (0.25 %R +0.05 )
no visible damage
± 0.5 %R
no visible damage
4.16
21 (Ua
1
)
21 (Ub)
21 (Uc)
Robustness
of terminations
Tensile, bending,
and torsion
± (0.1 %R +0.01 )± (0.25 %R +0.05 )± 0.5 %R
4.17 20 (Ta) Solderability
+235 °C; 2 s; solder bath
method; SnPb40
Good tinning
(> 95 % covered, no visible damage)
+245 °C; 3 s; solder bath
method; SnAg3Cu0.5
4.18.2 20 (Tb)
Resistance to
soldering heat
Unmounted components;
(260 ± 5) °C; (10 ± 1) s
± (0.1 %R +0.01 )
no visible damage
± (0.25 %R +0.05 )
no visible damage
± 0.5 %R
no visible damage
4.19 14 (Na)
Rapid change
of temperature
30min at -55 °C
30min at 155°C
5 cycles ± (0.1 %R +0.01 )± (0.25 %R +0.05 )± 0.5 %R
MBA/SMA 0204: 500 cycles
MBB/SMA 0207: 200 cycles
MBE/SMA 0414: 100 cycles
± (0.5 %R +0.05 ) ± (0.5 %R +0.05 ) ± (0.5 %R +0.05 )
4.22 6 Vibration
10 sweep cycles per
direction; 10 Hz to2000 Hz
1.5 mm or 200 m/s
2
± (0.1 %R +0.01 )± (0.25 %R +0.05 )± 0.5 %R
4.23
Climatic
sequence:
4.23.2 2 (Ba) Dry heat 155 °C; 16h
4.23.3 30 (Db)
Damp heat,
cyclic
55 °C; 24h;
90% to100%RH; 1 cycle
4.23.4 1 (Aa) Cold -55 °C; 2h
4.23.5 13 (M)
Low air
pressure
8.5kPa; 2h;
15 °Cto35 °C
4.23.6 30 (Db)
Damp heat,
cyclic
55°C; 5days;
95 %to100%RH; 5 cycles
± (0.5 %R +0.05 )
no visible damage
± (1 %R +0.05 )
no visible damage
± 2 %R
no visible damage
4.23.7 DC load apply rated power for 1 min
