74ALVC16240DTR

© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 1
1 Publication Order Number:
74ALVC16240/D
74ALVC16240
Low−Voltage 1.8/2.5/3.3 V
16−Bit Buffer
With 3.6 V−Tolerant Inputs and Outputs
(3−State, Inverting)
The 74ALVC16240 is an advanced performance, inverting 16−bit
buffer. It is designed for very high−speed, very low−power operation
in 1.8 V, 2.5 V or 3.3 V systems.
The 74ALVC16240 is nibble controlled with each nibble
functioning identically, but independently. The control pins may be
tied together to obtain full 16−bit operation. The 3−state outputs are
controlled by an Output Enable (OEn) input for each nibble. When
OEn is LOW, the outputs are on. When OEn is HIGH, the outputs are
in the high impedance state.
Designed for Low Voltage Operation: V
CC
= 1.65−3.6 V
3.6V Tolerant Inputs and Outputs
High Speed Operation: 3.0 ns max for 3.0 to 3.6 V
3.7 ns max for 2.3 to 2.7 V
6.0 ns max for 1.65 to 1.95 V
Static Drive: ±24 mA Drive at 3.0 V
±12 mA Drive at 2.3 V
±4 mA Drive at 1.65 V
Supports Live Insertion and Withdrawal
I
OFF
Specification Guarantees High Impedance When V
CC
= 0 V
Near Zero Static Supply Current in All Three Logic States (40 mA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds ±250 mA @ 125°C
ESD Performance: Human Body Model >2000 V;
Machine Model >200 V
Second Source to Industry Standard 74ALVC16240
To ensure the outputs activate in the 3−state condition, the output enable pins
should be connected to V
CC
through a pull−up resistor. The value of the resistor is
determined by the current sinking capability of the output connected to the OE pin.
MARKING DIAGRAM
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
TSSOP−48
DT SUFFIX
CASE 1201
1
48
74ALVC16240DT
AWLYYWW
1
48
Device Package Shipping
ORDERING INFORMATION
74ALVC16240DTR TSSOP 2500/Tape & Reel
http://onsemi.com
74ALVC16240
http://onsemi.com
2
481
OE2OE1
472
D0O0
463
D1O1
454
GNDGND
445
D2O2
436
D3O3
427
V
CC
V
CC
418
D4O4
409
D5O5
3910
GNDGND
3811
D6O6
3712
D7O7
3613
D8O8
3514
D9O9
3415
GNDGND
3316
D10O10
3217
D11O11
3118
V
CC
V
CC
3019
D12O12
2920
D13O13
2821
GNDGND
2722
D14O14
2623
D15O15
2524
OE3OE4
OE1
OE2
D0:3
D4:7
O0:3
O4:7
OE3
OE4
D8:11
D12:15
O8:11
O12:15
One of Four
1
48
25
24
Figure 1. 48−Lead Pinout
(Top View)
Figure 2. Logic Diagram
1
48
25
24
D0
47
D1
46
D2
44
D3
43
O0
2
EN1
OE1
OE2
OE3
OE4
O1
3
O2
5
O3
6
EN2
EN3
EN4
D4
41
D5
40
D6
38
D7
37
O4
8
O5
9
O6
11
O7
12
D8
36
D9
35
D10
33
D11
32
O8
13
O9
14
O10
16
O11
17
D12
30
D13
29
D14
27
D15
26
O12
19
O13
20
O14
22
O15
23
1
2
3
4
1
1
1
1
PIN NAMES
Function
Output Enable Inputs
Inputs
Outputs
Pins
OEn
D0−D15
O0−O15
Figure 3. IEC Logic Diagram
OE1 D0:3 O0:3 OE2 D4:7 O4:7 OE3 D8:11 O8:11 OE4 D12:15 O12:15
L L H L L H L L H L L H
L H L L H L L H L L H L
H X Z H X Z H X Z H X Z
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions Are Acceptable, for
I
CC
reasons, DO NOT FLOAT Inputs
74ALVC16240
http://onsemi.com
3
MAXIMUM RATINGS (Note 1)
Symbol Parameter Value Unit
V
CC
DC Supply Voltage *0.5 to )4.6 V
V
I
DC Input Voltage *0.5 to )4.6 V
V
O
DC Output Voltage *0.5 to )4.6 V
I
IK
DC Input Diode Current V
I
< GND *50 mA
I
OK
DC Output Diode Current V
O
< GND *50 mA
I
O
DC Output Sink/Source Current $50 mA
I
CC
DC Supply Current per Supply Pin $100 mA
I
GND
DC Ground Current per Ground Pin $100 mA
T
STG
Storage Temperature Range *65 to )150 °C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds 260 °C
T
J
Junction Temperature Under Bias )150 °C
q
JA
Thermal Resistance (Note 2) 90 °C/W
MSL Moisture Sensitivity Level 1
F
R
Flammability Rating Oxygen Index: 30% − 35% UL−94−VO (0.125 in)
V
ESD
ESD Withstand Voltage Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
u2000
u200
N/A
V
I
LATCH−UP
Latch−Up Performance Above V
CC
and Below GND at 125°C (Note 6) $250 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. I
O
absolute maximum rating must be observed.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
V
CC
Supply Voltage Operating
Data Retention Only
1.65
1.2
3.3
3.3
3.6
3.6
V
V
I
Input Voltage (Note 7) −0.5 3.6 V
V
O
Output Voltage (Active State)
(3−State)
0
0
V
CC
3.6
V
T
A
Operating Free−Air Temperature −40 +85 °C
Dt/DV
Input Transition Rise or Fall Rate, V
IN
from 0.8 V to 2.0 V, V
CC
= 2.5 V ±0.2 V
V
CC
= 3.0 V ±0.3 V
0
0
20
10
ns/V
7. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.

74ALVC16240DTR

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC BUFFER INVERT 3.6V 48TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
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