© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1061_X7R_RADIAL_SRR • 9/1/2016 10
Radial Through Hole Multilayer Ceramic Capacitors – SRR Series, Radial, C
3
Technology, X7R, 50 – 200 VDC (Commercial Grade)
Table 2 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Solderability J–STD–002
Magnication50X.Conditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBat215°Ccategory3
c)MethodD,category3at260°C
Temperature Cycling JESD22MethodJA–104 1,000cycles(−55°Cto+125°C),Measurementat24hours.+/−2hoursaftertestconclusion.
BiasedHumidity
MIL–STD–202Method
103
LoadHumidity:1,000hours85°C/85%RHandRatedVoltage.Add100Kohmresistor.
Measurementat24hours.+/−2hoursaftertestconclusion.
LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours.+/−2hoursaftertestconclusion.
Moisture Resistance
t=24hours/cycle.Steps7aand7bnotrequired.Unpowered.
Measurementat24hours.+/−2hoursaftertestconclusion.
Thermal Shock
−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds.Dwelltime–15minutes.Air–Air.
HighTemperatureLife
108
1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.
Storage Life
150°C,0VDC,for1,000hours.
Vibration
MIL–STD–202Method
204
5gfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB.031"thick7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2,000Hz.
Resistance to Soldering
Heat
ConditionB.Nopre-heatofsamples.Note:singlewavesolder–procedure2.
Terminal Strength
ConditionsA(2.3kgor5lbs)
Mechanical Shock
Figure 1 of Method 213, Condition F.
Resistance to Solvents
Addaqueouswashchemical,OKEMCleanorequivalent.
Storage & Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp,
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºC,andmaximum
storagehumiditynotexceed70%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon
the parts, and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock
should be used promptly, preferably within 1.5 years of receipt.
