CM1693−04DE, CM1693−06DE, CM1693−08DE
http://onsemi.com
8
PACKAGE DIMENSIONS
UDFN16, 3.3x1.35, 0.4P
CASE 517BE−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
D2
E2
BOTTOM VIEW
b
e
16X
0.10 B
0.05
AC
C
K
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
16X
A
A1
(A3)
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L
16X
1
8
916
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 3.30 BSC
D2 2.70 2.90
E 1.35 BSC
E2 0.30 0.50
e 0.40 BSC
K 0.15 −−−
L 0.20 0.30
3.00
16X
0.25
16X
0.50
1.55
0.40
DIMENSIONS: MILLIMETERS
0.40
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
DETAIL B
A1
A3
DETAIL B
MOLD CMPD
EXPOSED Cu
OPTIONAL
CONSTRUCTION
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
L1 −−− 0.05
NOTE 4
DETAIL A
PITCH
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
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