2016-05-30
Page 2
BSS87
Rev.
2.0
Thermal Characteristics
Parameter
Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - case
(Pin 2)
R
thJC
- - 10 K/W
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
1)
R
thJA
-
-
-
-
125
70
Electrical Characteristics, at T
j
= 25 °C, unless otherwise specified
Parameter
Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
V
GS
=0, I
D
=250µA
V
(BR)DSS
240 - - V
Gate threshold voltage, V
GS
= V
DS
I
D
=108µA
V
GS(th)
0.8 1.2 1.8
Zero gate voltage drain current
V
DS
=240V, V
GS
=0, T
j
=25°C
V
DS
=240V, V
GS
=0, T
j
=150°C
I
DSS
-
-
-
-
0.1
100
µA
Gate-source leakage current
V
GS
=20V, V
DS
=0
I
GSS
- - 10 nA
Drain-source on-state resistance
V
GS
=4.5V, I
D
=0.24A
R
DS(on)
- 4.6 7.5
W
Drain-source on-state resistance
V
GS
=10V, I
D
=0.26A
R
DS(on)
- 3.9 6
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.