AOW29S50

AOW29S50
500V 29A
α
αα
α
MOS
TM
Power Transistor
General Description Product Summary
V
DS
@ T
j,max
600V
I
DM
120A
R
DS(ON),max
0.15
Q
g,typ
26.6nC
E
oss
@ 400V 6.3µJ
100% UIS Tested
100% R
g
Tested
Symbol
V
DS
V
GS
I
DM
I
AR
E
AR
E
AS
MOSFET dv/dt ruggedness
Peak diode recovery dv/dt
H
T
J
, T
STG
T
L
Symbol
R
θJA
R
θCS
R
θJC
0.35
AOW29S50
AOW29S50
65
0.5
608
-55 to 150
100
20
357
Maximum Junction-to-Ambient
A,D
300
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
J
Parameter
V/ns
°C/W
W/
o
C
°C
Thermal Characteristics
°C/W
Maximum Junction-to-Case
°CJunction and Storage Temperature Range
Maximum Case-to-sink
A
°C/W
The AOW29S50 has been fabricated using the advanced
αMOS
TM
high voltage process that is designed to deliver
high levels of performance and robustness in switching
applications.
By providing low R
DS(on)
, Q
g
and E
OSS
along with
guaranteed avalanche capability this part can be adopted
quickly into new and existing offline power supply designs.
V
UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
Drain-Source Voltage 500
Units
A6
±30Gate-Source Voltage V
A
120
T
C
=100°C
Pulsed Drain Current
C
Continuous Drain
Current
2.9
T
C
=25°C
I
D
Avalanche Current
C
29
18
Derate above 25
C
Power Dissipation
B
Single pulsed avalanche energy
G
W
70
P
D
Repetitive avalanche energy
C
mJ
mJ
T
C
=25°C
dv/dt
G
D
S
Top View
TO-262
Bottom View
G
D
S
G
D
S
AOW29S50
Rev 0: April 2012
www.aosmd.com
Page 1 of 6
AOW29S50
Symbol Min Typ Max Units
500 - -
550 600 -
- - 1
- 10 -
I
GSS
Gate-Body leakage current
- - ±100
nΑ
V
GS(th)
Gate Threshold Voltage
2.6 3.3 3.9 V
- 0.13 0.15
- 0.34 0.4
V
SD
- 0.85 - V
I
S
Maximum Body-Diode Continuous Current - - 29 A
I
SM
- - 120 A
C
iss
- 1312 - pF
C
oss
- 88 - pF
C
o(er)
- 78 - pF
C
o(tr)
- 227 - pF
C
rss
- 2.5 - pF
R
g
- 4.8 -
Q
g
- 26.6 - nC
Q
gs
- 6.2 - nC
Q
gd
- 9.2 - nC
t
D(on)
- 28 - ns
t
r
- 39 - ns
t
D(off)
- 103 - ns
t
f
- 40 - ns
t
rr
- 387
- ns
I
rm
- 29.6
- A
Q
rr
- 7.3
-
µC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
V
GS
=0V, V
DS
=100V, f=1MHz
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
I
D
=250µA, V
GS
=0V, T
J
=150°C
Effective output capacitance, energy
related
H
V
GS
=0V, V
DS
=0 to 400V, f=1MHz
SWITCHING PARAMETERS
I
DSS
Effective output capacitance, time
related
I
R
DS(ON)
Static Drain-Source On-Resistance
I
S
=14.5A,V
GS
=0V, T
J
=25°C
Diode Forward Voltage
Input Capacitance
V
GS
=0V, V
DS
=100V, f=1MHz
Output Capacitance
I
F
=14.5A,dI/dt=100A/µs,V
DS
=400V
Reverse Transfer Capacitance
BV
DSS
V
GS
=10V, V
DS
=400V, I
D
=14.5A,
R
G
=25
Turn-Off Fall Time
Total Gate Charge
V
GS
=10V, V
DS
=400V, I
D
=14.5A
Gate Source Charge
Gate Drain Charge
V
GS
=10V, I
D
=14.5A, T
J
=25°C
V
DS
=400V, T
J
=150°C
Zero Gate Voltage Drain Current
Body Diode Reverse Recovery Charge
I
F
=14.5A,dI/dt=100A/µs,V
DS
=400V
Maximum Body-Diode Pulsed Current
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
Turn-Off DelayTime
Body Diode Reverse Recovery Time
Peak Reverse Recovery Current
I
F
=14.5A,dI/dt=100A/µs,V
DS
=400V
V
V
GS
=10V, I
D
=14.5A, T
J
=150°C
Drain-Source Breakdown Voltage
I
D
=250µA, V
GS
=0V, T
J
=25°C
µA
V
DS
=0V, V
GS
30V
V
DS
=500V, V
GS
=0V
V
DS
=5V,I
D
=250µA
A. The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C, Ratings are based on low frequency and duty cycles to keep initial T
J
=25°C.
D. The R
θJA
is the sum of the thermal impedance from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse ratin g.
G. L=60mH, I
AS
=4.5A, V
DD
=150V, Starting T
J
=25°C
H. C
o(er)
is a fixed capacitance that gives the same stored energy as C
oss
while V
DS
is rising from 0 to 80% V
(BR)DSS.
I. C
o(tr)
is a fixed capacitance that gives the same charging time as C
oss
while V
DS
is rising from 0 to 80% V
(BR)DSS.
J. Wavesoldering only allowed at leads.
Rev 0: April 2012 www.aosmd.com Page 2 of 6
AOW29S50
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
5
10
15
20
25
30
35
40
45
50
55
0 5 10 15 20
V
DS
(Volts)
Figure 1: On-Region Characteristics@25°C
I
D
(A)
V
GS
=4.5V
6V
10V
7V
0.01
0.1
1
10
100
1000
2 4 6 8 10
V
GS
(Volts)
Figure 3: Transfer Characteristics
I
D
(A)
-55°C
V
DS
=20V
25°C
125°C
0.0
0.1
0.2
0.3
0.4
0.5
0 10 20 30 40 50 60
I
D
(A)
Figure 4: On-Resistance vs. Drain Current and
Gate Voltage
R
DS(ON)
(
)
V
GS
=10V
0
0.5
1
1.5
2
2.5
3
-100 -50 0 50 100 150 200
Temperature (°C)
Figure 5: On-Resistance vs. Junction Temperature
Normalized On-Resistance
V
GS
=10V
I
D
=14.5A
0.8
0.9
1
1.1
1.2
-100 -50 0 50 100 150 200
T
J
(
o
C)
Figure 6: Break Down vs. Junction Temperature
BV
DSS
(Normalized)
0
5
10
15
20
25
30
35
40
0 5 10 15 20
V
DS
(Volts)
Figure 2: On-Region Characteristics@125°C
I
D
(A)
V
GS
=4.5V
5V
10V
6V
5V
5.5V 5.5V
7V
Rev 0: April 2012 www.aosmd.com Page 3 of 6

AOW29S50

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 500V 29A TO262
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet