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BAS40H,115
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P23
BAS40_1PSXXS
B4X_SER
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP Semiconduc
tors N.V
.
2015. Al
l rights reserved.
Product data sheet
Rev
.
9 — 18 March 2015
12 of 22
NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-p
urpose Scho
ttky diode
s
1
1.
Solderi
ng
Dimensions in mm
Fig 15.
Reflow soldering footprint SOD323 (SC-76)
Dimensions in mm
Fig 16.
Wave soldering footprin
t SOD323 (SC-76)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 17.
Reflow soldering footprint SOD523 (SC-79)
msa433
1.65
0.50
(2
×
)
2.10
1.60
2.80
0.60
3.05
0.50
0.95
solder lands
solder resist
occupied area
solder paste
msa415
1.40
4.40
5.00
1.20
2.75
preferred transport direction during soldering
solder lands
solder resist
occupied area
mgs343
1.80
1.90
0.30
0.40
0.50
1.20
0.60
2.15
solder lands
solder resist
occupied area
solder paste
BAS40_1PSXXS
B4X_SER
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP Semiconduc
tors N.V
.
2015. Al
l rights reserved.
Product data sheet
Rev
.
9 — 18 March 2015
13 of 22
NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-p
urpose Scho
ttky diode
s
Dimensions in mm
Fig 18.
Reflow soldering footprint SOT23 (TO-236AB)
Dimensions in mm
Fig 19.
Wave soldering footprin
t SOT23 (TO-236AB)
MSA439
1.00
0.60
(3x)
1.30
1
2
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
solder lands
solder resist
occupied area
solder paste
MSA427
4.00
4.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
BAS40_1PSXXS
B4X_SER
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP Semiconduc
tors N.V
.
2015. Al
l rights reserved.
Product data sheet
Rev
.
9 — 18 March 2015
14 of 22
NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-p
urpose Scho
ttky diode
s
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20.
Reflow soldering footprint
SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 21.
Reflow soldering footprin
t SOD882
1.6
1.6
2.9
4
4.4
1.1
1.2
2.1
1.1
(2
×
)
solder lands
solder resist
occupied area
solder paste
mbl872
1.30
0.30
R = 0.05 (8
×
)
R = 0.05 (8
×
)
0.60
(2
×
)
0.70
(2
×
)
0.80
(2
×
)
0.90
0.30
(2
×
)
0.40
(2
×
)
0.50
(2
×
)
solder lands
solder resist
occupied area
solder paste
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P23
BAS40H,115
Mfr. #:
Buy BAS40H,115
Manufacturer:
Nexperia
Description:
Schottky Diodes & Rectifiers SCHOTTKY 40V 120MA
Lifecycle:
New from this manufacturer.
Delivery:
DHL
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Ups
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EMS
Payment:
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