10
Note: Refer to application note AN1027 for more information on
soldering LED components.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Avago Technologies LED Configuration
Note: Electrical connection between bottom surface of LED die
and the lead frame material through conductive paste of solder.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB
during soldering process.
• At elevated temperature, the LED is more
susceptible to mechanical stress. Therefore, PCB
must be allowed to cool down to room temperature
prior to handling, which includes removal of jigs,
fixtures or pallet.
• Special attention must be given to board fabrication,
solder masking, surface platting and lead holes
size and component orientation to assure the
solderability.
CATHODE
• Over sizing of plated through hole can lead to
twisting or improper LED placement during auto
insertion. Under sizing plated through hole can
lead to mechanical stress on the epoxy lens during
clinching.
• Recommended PC board plated through hole sizes for
LED component leads:
Figure 8. Recommended wave soldering profile.
LAMINAR WAVE
BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
01020
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE
OF PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
LEAD SOLDER: SN63; FLUX: RMA
LEAD FREE SOLDER: 96.5% Sn, 3.0% Ag, 0.5% Cu
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
