Reference only
ETP1M101
21 / 23
7. Taping specification
7-1. Dimension of capacitors on tape
Inside crimp taping type < Lead code : M1 >
Pitch of component 12.7mm / Lead spacing 5.0mm
Unit : mm
Item Code Dimensions Remarks
Pitch of component
P 12.7+/-1.0
Pitch of sprocket hole
P0 12.7+/-0.2
Lead spacing
F 5.0+0.6/-0.2
Length from hole center to component center
P2 6.35+/-1.3
Deviation of progress direction
Length from hole center to lead
P1 3.85+/-0.7
Deviation along tape, left or right defect
S 0+/-2.0
They include deviation by lead bend .
Carrier tape width
W 18.0+/-0.5
Position of sprocket hole
W1 9.0+0/-0.5
Deviation of tape width direction
Lead distance between reference and bottom
plane
H0 16.0+/-0.5
Protrusion length
0.5 max.
Diameter of sprocket hole
D0 4.0+/-0.1
Lead diameter
d 0.50+/-0.05
Total tape thickness
t1 0.6+/-0.3
They include hold down tape thickness.
Total thickness of tape and lead wire
t2 1.5 max.
Deviation across tape
h1
2.0 max.Dimension codeW
1.0 max.except as above
h2
Portion to cut in case of defect
L 11.0+0/-1.0
Hold down tape width
W0 9.5 min.
Hold down tape position
W2 1.5+/-1.5
Coating extension on lead
e
Up to the end of crimp
P2
P
P1
P0
L
D0
H0
W0
W1
W
0
h1
h2
S
t1
t2
Marking
W2
F
e
d
Reference only
ETP1DG01
22 / 23
Straight taping type < Lead code : DG >
Pitch of component 12.7mm / Lead spacing 2.5mm
Unit : mm
Item Code Dimensions Remarks
Pitch of component
P 12.7+/-1.0
Pitch of sprocket hole
P0 12.7+/-0.2
Lead spacing
F 2.5+0.4/-0.2
Length from hole center to component center
P2 6.35+/-1.3
Deviation of progress direction
Length from hole center to lead
P1 5.1+/-0.7
Deviation along tape, left or right defect
S 0+/-2.0
They include deviation by lead bend .
Carrier tape width
W 18.0+/-0.5
Position of sprocket hole
W1 9.0+0/-0.5
Deviation of tape width direction
Lead distance between reference and bottom
plane
H 20.0+/-0.5
Protrusion length
0.5 max.
Diameter of sprocket hole
D0 4.0+/-0.1
Lead diameter
d 0.50+/-0.05
Total tape thickness
t1 0.6+/-0.3
They include hold down tape thickness.
Total thickness of tape and lead wire
t2 1.5 max.
Deviation across tape
h1
1.0 max.
h2
Portion to cut in case of defect
L 11.0+0/-1.0
Hold down tape width
W0 9.5 min.
Hold down tape position
W2 1.5+/-1.5
Coating extension on lead
e 1.5 max.
P2 P
P1
P0
L
D0
H
W0
W1
W
0
h1
h2
S
t1
t2
Marking
W2
F
e
d
Reference only
ETP2R01
23 / 23
7-2. Splicing way of tape
1) Adhesive force of tape is over 3N at test condition as below.
2) Splicing of tape
a) When base tape is spliced
Base tape shall be spliced by cellophane tape.
(Total tape thickness shall be less than 1.05mm.)
b) When hold down tape is spliced
Hold down tape shall be spliced with overlapping.
(Total tape thickness shall be less than 1.05mm.)
ape are spliced
Base tape and adhesive tape shall be spliced with splicing tape.
c) When both tape are spliced
Base tape and hold down tape shall be spliced with splicing tape.
Hold down tape
Base tape
W
Unit : mm
Progress direction
in production line
Hold down tape
Base tape
Cellophane tape
A
bout 30 to 50
Progress direction
in production line
Hold down tape
Base tape
20 to 30
Unit : mm
No lifting for the direction of
progressing

RCE5C2A3R0C0A2H03B

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Multilayer Ceramic Capacitors MLCC - Leaded 3pF 100volts C0G LS=2.5mm 0.25 pF
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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