LTC4355
16
4355ff
For more information www.linear.com/LTC4355
typical applications
36V to 72V/10A with Positive Supply and Negative Supply Diode-ORing,
Combined Fault Outputs, and Zener Clamps on MOSFET Gates
4355 TA07
LTC4355
LTC4354
FAULT
GND
GATE1 GATE2IN1 OUTIN2
MON1
MON2
SET
12.7k
340k
12.7k
1µF
340k
10A
12k
2k
33k
GREEN LED
PANASONIC
LN1351C
10A
15A
15A
IRLR3110ZPbF
IRLR3110ZPbF
IRLR3110ZPbF
IRLR3110ZPbF
V
A
= 48V
V
B
= 48V
V
SS
V
CC
GBGADBDA
GND
A
GND
B
2k
VDSFLT
FUSEFLT1
FUSEFLT2
PWRFLT1
PWRFLT2
LOAD
12V ZENER
CMZ4699
12V ZENER
CMZ4699
100k
2N2222
LTC4355
17
4355ff
For more information www.linear.com/LTC4355
DE Package
14-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1708 Rev B)
3.00 ±0.10
(2 SIDES)
4.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 ± 0.10
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
3.00 REF
1.70 ± 0.05
17
148
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DE14) DFN 0806 REV B
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
3.00 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 ±0.05
0.70 ±0.05
3.60
±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.25 ± 0.05
0.50 BSC
3.30 ±0.05
3.30 ±0.10
0.50 BSC
package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC4355
18
4355ff
For more information www.linear.com/LTC4355
package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.53 ±0.152
(.021 ±.006)
0.18
(.007)
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ±0.038
(.0120 ±.0015)
TYP
0.50
(.0197)
BSC
SEATING
PLANE
MSOP (MS16) 0213 REV A
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16151413121110
1 2 3 4 5 6 7 8
9
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
0.1016 ±0.0508
(.004 ±.002)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
0.280 ±0.076
(.011 ±.003)
REF
4.90 ±0.152
(.193 ±.006)
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev A)
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0° – 8° TYP
.008 – .010
(0.203 – 0.254)
1
N
2
3
4
5
6
7
8
N/2
.150 – .157
(3.810 – 3.988)
NOTE 3
16
15
14
13
.386 – .394
(9.804 – 10.008)
NOTE 3
.228 – .244
(5.791 – 6.197)
12
11 10
9
S16 REV G 0212
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
.245
MIN
N
1 2 3 N/2
.160 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE
S Package
16-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)

LTC4355CMS#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Power Management Specialized - PMIC Pos Hi V Ideal Diode-OR w/ In S & Fuse M
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union