IPP60R520CPXKSA1

IPP60R520CP
CoolMOS
TM
Power Transistor
Features
• Lowest figure-of-merit R
ON
x Q
g
• Ultra low gate charge
• Extreme dv/dt rated
• High peak current capability
• Qualified according to JEDEC
1)
for target applications
• Pb-free lead plating; RoHS compliant
CoolMOS CP is designed for:
• Hard switching SMPS topologies
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current
I
D
T
C
=25 °C
A
T
C
=100 °C
Pulsed drain current
2)
I
D,pulse
T
C
=25 °C
Avalanche energy, single pulse
E
AS
I
D
=2.5 A, V
DD
=50 V
166 mJ
Avalanche energy, repetitive t
AR
2),3)
E
AR
I
D
=2.5 A, V
DD
=50 V
Avalanche current, repetitive t
AR
2),3)
I
AR
A
MOSFET dv /dt ruggedness dv /dt
V
DS
=0...480 V
V/ns
Gate source voltage
V
GS
static V
AC (f >1 Hz)
Power dissipation
P
tot
T
C
=25 °C
W
Operating and storage temperature
T
j
, T
stg
°C
Mounting torque M3 and M3.5 screws 60 Ncm
±30
66
-55 ... 150
0.25
2.5
50
±20
Value
6.8
4.3
17
V
DS
@ T
j,max
650 V
R
DS(on),max
@ T
j
= 25°C 0.520
Q
g,typ
24 nC
Product Summary
PG-TO220
Type Package Marking
IPP60R520CP PG-TO220 6R520P
Rev. 2.
1 page 1 2012-01-09
IPP60R520CP
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous diode forward current
I
S
A
Diode pulse current
2)
I
S,pulse
17
Reverse diode dv /dt
4)
dv /dt 15 V/ns
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case
R
thJC
- - 1.9 K/W
R
thJA
leaded - - 62
Soldering temperature,
wavesoldering only allowed at leads
T
sold
1.6 mm (0.063 in.)
from case for 10 s
- - 260 °C
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0 V, I
D
=250 µA
600 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=0.25 mA
2.5 3 3.5
Zero gate voltage drain current
I
DSS
V
DS
=600 V, V
GS
=0 V,
T
j
=25 °C
--1µA
V
DS
=600 V, V
GS
=0 V,
T
j
=150 °C
-10-
Gate-source leakage current
I
GSS
V
GS
=20 V, V
DS
=0 V
- - 100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=10 V, I
D
=3.8 A,
T
j
=25 °C
- 0.47 0.52
V
GS
=10 V, I
D
=3.8 A,
T
j
=150 °C
- 1.3 -
Gate resistance
R
G
f =1 MHz, open drain - 1.3 -
Value
T
C
=25 °C
3.8
Values
Thermal resistance, junction -
ambient
Rev. 2.1 page 2 2012-01-09
IPP60R520CP
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
Input capacitance
C
iss
- 630 - pF
Output capacitance
C
oss
-32-
Effective output capacitance, energy
related
5)
C
o(er)
-30-
Effective output capacitance, time
related
6)
C
o(tr)
-77-
Turn-on delay time
t
d(on)
-17-ns
Rise time
t
r
-12-
Turn-off delay time
t
d(off)
-74-
Fall time
t
f
-16-
Gate Charge Characteristics
Gate to source charge
Q
gs
-3-nC
Gate to drain charge
Q
gd
-11-
Gate charge total
Q
g
-2431
Gate plateau voltage
V
plateau
- 4.7 - V
Reverse Diode
Diode forward voltage
V
SD
V
GS
=0 V, I
F
=3.8 A,
T
j
=25 °C
- 0.8 1.2 V
Reverse recovery time
t
rr
- 230 - ns
Reverse recovery charge
Q
rr
- 2.5 - µC
Peak reverse recovery current
I
rrm
-20-A
1)
J-STD20 and JESD22
2)
Pulse width t
p
limited by T
j,max
5)
C
o(er)
is a fixed capacitance that gives the same stored energy as C
oss
while V
DS
is rising from 0 to 80% V
DSS.
V
R
=400 V, I
F
=I
S
,
di
F
/dt =100 A/µs
6)
C
o(tr)
is a fixed capacitance that gives the same charging time as C
oss
while V
DS
is rising from 0 to 80% V
DSS.
3)
Repetitive avalanche causes additional power losses that can be calculated as P
AV
=E
AR
*f.
4)
I
SD
=I
D
, di/dt400A/µs, V
DClink
=400V, V
peak
<V
(BR)DSS
, T
j
<T
jmax
, identical low side and high side switch.
Values
V
GS
=0 V, V
DS
=100 V,
f =1 MHz
V
DD
=400 V,
V
GS
=10 V, I
D
=3.8 A,
R
G
=14.7
V
DD
=400 V, I
D
=3.8 A,
V
GS
=0 to 10 V
V
GS
=0 V, V
DS
=0 V
to 480 V
Rev. 2.1 page 3 2012-01-09

IPP60R520CPXKSA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-CH 650V 6.8A TO-220
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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