© 2005 Fairchild Semiconductor Corporation DS500151 www.fairchildsemi.com
March 1999
Revised June 2005
74LVT16244 • 74LVTH16244 Low Voltage16-Bit Buffer/Line Driver with 3-STATE Outputs
74LVT16244 • 74LVTH16244
Low Voltage16-Bit Buffer/Line Driver
with 3-STATE Outputs
General Description
The LVT16244 and LVTH16244 contain sixteen non-invert-
ing buffers with 3-STATE outputs designed to be employed
as a memory and address driver, clock driver, or bus ori-
ented transmitter/receiver. The device is nibble controlled.
Individual 3-STATE control inputs can be shorted together
for 8-bit or 16-bit operation.
The LVTH16244 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These buffers and line drivers are designed for low-voltage
(3.3V) V
CC
applications, but with the capability to provide a
TTL interface to a 5V environment. The LVT16244 and
LVTH16244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining a low power dissipation
Features
■ Input and output interface capability to systems at
5V V
CC
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16244),
also available without bushold feature (74LVT16244).
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink 32 mA/ 64 mA
■ Functionally compatible with the 74 series 16244
■ Latch-up performance exceeds 500 mA
■ ESD performance:
Human-body model
2000V
Machine model
200V
Charged-drive model
1000V
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Note 1: Ordering code “G” indicates Trays.
Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Order Number
Package
Number
Package Description
74LVT16244G
(Note 1)(Note 2)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVT16244MEA
(Note 2)
MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16244MTD
(Note 2)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16244G
(Note 1)(Note 2)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVTH16244MEA
(Note 2)
MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16244MTD
(Note 2)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide