[Data Sheet]
Stress stren
th accordin
to
he mountin
osition:
A＞B＞C＞D
so
lease
a
attention to the touch on
roduct.
We recommend the solderin
attern that shows on the ri
ht.
It will be different accordin
to mountin
situation of circuit board,
therefore,
lease concern before desi
nin
.
※The
roduct has ado
ted the electrode structure that it should
solder with back electrode of the
roduct.
Thus,
lease be informed that the sha
e of electrode
in of
solder fillet formation is not
uaranteed.
In case of carryin
out flow solderin
of surroundin
parts without recommended conditions, please
contact us for inquiries.
・Please set appropriate reflow temperature based on our product usa
e conditions and specification.
・The max for reflowin
is 2 times, please finish the second reflow solderin
and flow solderin
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
to prevent electrostatic char
e.
with other parts within the usa
e limitation after open the moistureproof packa
e.
・Compare with N2 reflow, durin
air reflow, because of the heat and surroundin
conditions,
it may cause the discoloration of the resin.
４－３. Mountin
Location
The stress like bendin
stress of circuit board dividin
after mountin
, may cause LED packa
e crack
or dama
e of LED internal
unction, therefore,
lease concern the mountin
direction and
osition
to avoid bendin
or screwin
with
reat stress of the circuit board.
adhere to top cover tape. Therefore, the ma
net should be set on parts feeder cassette of
・For our product that has no solder resist, because of its solder amount and solderin
conditions,
one of its specific characteristics is that solder will penetrate into LED. Thus, there's hi
h possibility
that will influence its reliability.Therefore, please be informed, concernin
it before usin
it.
directly on the sealin
section.
４-２-２. Mini Packa
e (Smaller than 1608 size)
・Vibration may result in low mountin
rate since it will cause the static electricity of product and
[SML-D22x series]
shift (within 3℃/sec. of temperature
radient) durin
the flow solderin
of surroundin
parts.
４－１. Solderin
４．Mountin
・No resin hardenin
a
ent such as filler is used in the sealin
resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress durin
solderin
process and
finally has bad influence on the productʼs reliability.
・The product is not
uaranteed for flow solderin
.
・Do not expose the product in the environment of hi
h temperature (over 100℃) or rapid temperature
４－２. Automatic Mountin
４-２-１. Silicon Resin Sealin
Product
The sealin
resin of LED is very soft, so please select adsorption nozzle that would not apply stress
４―４. Mechanical Stress after Mountin
The mechanical stress may dama
e the LED after Circuit Mountin
,
４－５．Solderin
Pattern for Recommendation
2.4
1.0
0.7
0.2
Mask open area ratio : 80%
Mask thickness : 100μm
Referenc
(Unit : mm)
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
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2017.11 - Rev.003
