Voltage: 2.4 to 39 Volts
Power: 500 mWatts
RoHS Device
Page 1
REV:C
Features
-Planar die construction.
-500mW power dissipation.
-Ideally suited for automated assembly
process.
-Ultra small surface mount package.
Mechanical data
-Case: SOD-123, Molded plastic
-Terminals: Solderable per MIL-STD-
202G,method 208
-Polarity: Indicated by cathode band.
-Mounting position: Any
Marking: see table on page2
CZRW55C2V4-G Thru CZRW55C39-G
Parameter
Symbol
Value
Unit
Maximum Ratings (TA=25°C, unless otherwise specified)
0.9
V
VF
Forward voltage at IF=10mA (Note 2)
Dimensions in inches and (millimeter)
Power dissipation (Note 1)
500
PD mW
QW-BZ016
SOD-123
250
°C/W
RθJA
Thermal resistance, junction to ambient air
Operating junction and storage temperature range
-65 to +150
TJ, TSTG
°C
SMD Zener Diodes
Comchip Technology CO., LTD.
Note:
2
1. Device mounted on ceramic PCB: 7.6mm×9.4mm×0.87mm with pad area 25mm.
2. Short duration test pulse used to minimize self-heating effect.
0.026(0.65)
0.018(0.45)
0.152(3.85)
0.140(3.55)
0.067(1.70)
0.059(1.50)
0.110(2.80)
0.102(2.60)
0.049(1.25)
0.041(1.05)
0.006(0.15)
Max.
0.02(0.50) REF
0.004(0.10)
Max.
-
+
3. When provided,otherwise,parts are provided with date code only,and type number identifications appears on reel only.
4. f=1KHz
