ADG784
Rev. A | Page 9
OUTLINE DIMENSIONS
Figure 37. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG784BCPZ
−40°C to +85°C
20-Lead LFCSP_WQ CP-20-6
ADG784BCPZ-REEL
−40°C to +85°C
20-Lead LFCSP_WQ CP-20-6
ADG784BCPZ-REEL7
−40°C to +85°C
20-Lead LFCSP_WQ CP-20-6
1
Z = RoHS Compliant Part.
REVISION HISTORY
2/13—Rev. 0 to Rev. A
Changes to Pin Configuration ......................................................... 4
Updated Outline Dimensions .......................................................... 9
Changes to Ordering Guide ............................................................. 9
4/01—Revision 0: Initial Version
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02374-0-2/13(A)
