TVS8501V5
http://onsemi.com
6
PACKAGE DIMENSIONS
UDFN2 1.6x1.0, 1.1P
CASE 517CZ
ISSUE A
1
2X
0.58
DIMENSIONS: MILLIMETERS
1.00
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2X
RECOMMENDED
1.70
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
B
E
D
BOTTOM VIEW
b
2X
2X
0.08 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.08 C
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L
1
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 −−− 0.05
b 0.85 0.95
D 1.60 BSC
E 1.00 BSC
e 1.10 BSC
L 0.35 0.45
e/2
e
A
M
0.07 BC
A
M
0.07 BC
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