Package information L6210
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4 Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK
®
packages. ECOPACK
®
packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 5. PDIP 16 mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
(*)“D” and “E1” dimensions do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.25mm.
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 5.330 0.2098
A1 0.380 0.0150
A2 2.920 3.300 4.950 0.1150 0.1299 0.1949
b 0.360 0.460 0.560 0.0142 0.0181 0.0220
b2 1.140 1.520 1.780 0.0449 0.0598 0.0701
c 0.200 0.250 0.360 0.0079 0.0098 0.0142
D
(*)
18.670 19.180 19.690 0.7350 0.7551 0.7752
E 7.620 7.870 8.260 0.3000 0.3098 0.3252
E1
(*)
6.100 6.350 7.110 0.2402 0.2500 0.2799
e 2.540 0.1000
e1 17.780 0.7000
eA 7.620 0.3000
eB 10.920 0.4299
L 2.920 3.300 3.810 0.1150 0.1299 0.1500
PDIP 16
0015895 E
0015895_E