CC1206JRNPOBBN101 Datasheet CC1206JRNPOBBN271, CC1210JKNPOBBN821, CC0805JRNPO0BN470 | P13-P15

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Sep 08, 2005 V.0

Mid-voltage

Surface-Mount Ceramic Multilayer Capacitors

NP0/X7R

100 V to 500 V

Product specification

TEST TEST METHOD PROCEDURE REQUIREMENTS

Mounting

IEC 60384-

21/22

4.3

The capacitors may be mounted on printed-circuit boards or

ceramic substrates

No visible damage

Visual

inspection and

dimension

chec

4.4

Any applicable method using × 10 magnification In accordance with

specification

Capacitance

4.5.1

NP0:

f = 1 MHz for C ≤ 1 nF, measuring at voltage 1 V

rms

at 20 °C;

f = 1 KHz for C > 1 nF, measuring at voltage 1 V

rms

at 20 °C

X7R:

f = 1 KHz for C ≤ 10 µF, measuring at voltage 1 V

rms

at 20 °C

Within specified tolerance

Dissipation

factor (D.F.)

4.5.2

NP0: f = 1 MHz for C ≤ 1 nF, measuring at voltage 1 V

rms

at 20

°C; f = 1 KHz for C > 1 nF, measuring at voltage 1 V

rms

at 20 °C

X7R: f = 1 KHz for C ≤ 10 µF, measuring at voltage 1 V

rms

at 20

°C

In accordance with

specification

Insulation

resistance

4.5.3

At U

(DC) for 1 minute In accordance with

specification

Voltage proo

4.5.4.2

Test voltage (DC) applied for 1 minute

≤ 100 V: 2.5 × U

applied to NP0/X7R series

100 V < U

≤ 200 V: 1.5 × U

+100 V applied to NP0/X7R series

200 V < U

≤ 500 V: 1.3 × U

+100 V applied to NP0/X7R series

> 500 V: 1.3 × U

applied to NP0/X7R series

I: 7.5 mA

No breakdown or

flashover

Temperature

characteristic

4.6

Between minimum and maximum temperature NP0: l∆C/Cl: 30 ppm/°C

X7R: l∆C/Cl: 15%

Adhesion

4.15

A force applied for 10 seconds to the line joining the terminations

and in a plane parallel to the substrate

for size ≥ 0603: a force of 5 N applied

for size 0402: a force of 2.5 N applied

No visible damage

Table 10 Test condition, procedure and requirements

TESTS AND REQUIREMENTS

ww.yageo.com

Sep 08, 2005 V.0

Mid-voltage

Surface-Mount Ceramic Multilayer Capacitors

NP0/X7R

100 V to 500 V

Product specification

TEST TEST METHOD PROCEDURE REQUIREMENTS

Mounting in accordance with IEC 60384-22 paragraph

4.3

No visible damage

Bond strength

of plating on

end face

IEC 60384-

21/22

4.8

Conditions: bending 1 mm at a rate of 1 mm/s, radius jig

340 mm

NP0: l∆C/Cl: ≤ 1% or 0.5 pF

whichever is greater

X7R: l∆C/Cl: ≤ 10%

Resistance to

soldering heat

4.9

Precondition: 150 +0/–10 °C for 1 hour, then keep for

24 ±1 hours at room temperature

Preheating: for size ≤ 1206: 120 to 150 °C for 1 minute

Preheating: for size >1206: 100 to 120 °C for 1 minute

and 170 to 200 °C for 1 minute

Solder bath temperature: 260 ±5 °C

Dipping time: 10 ±0.5 seconds

Recovery time: 24 ±2 hours.

The termination shall be well tinned

NP0: l∆C/Cl: ≤ 0.5% or 0.5 pF

whichever is greater

X7R: l∆C/Cl: ≤ 10%

D.F.: within initial specified value

ins

: within initial specified value

Solderabilit

4.10

Unmounted chips completely immersed in a solder bath

at 235 ±5 °C

Dipping time: 2 ±0.5 seconds

Depth of immersion: 10 mm

The termination shall be well

tinned.

Preconditioning;

150 +0/–10 °C for 1 hour, then keep for 24 ±1 hours a

room temperature

5 cycles with following detail:

30 minutes at lower category temperature;

30 minutes at upper category temperature

Rapid change

temperature

4.11

Recovery time 24 ±2 hours.

No visual damage

NP0: l∆C/Cl: ≤ 1% or 1 pF

whichever is greater

X7R: l∆C/Cl: ≤ 15%

D.F.: within initial specified value

ins

: within initial specified value

Damp heat,

with U

load

4.13

Initial measurements; after 150 +0/-10 °C for 1 hour,

then keep for 24 ±1 hours at room temperature

Duration and conditions: 500 ±12 hours at 40 ±2 °C;

90 to 95% RH; U

applied

Final measurement: perform a heat treatment at

150 +0/–10 °C for 1 hour, final measurements shall be

carried out 24 ±1 hours after recovery at room

temperature without load.

NP0: l∆C/Cl: ≤ 2% or 1 pF

whichever is greater

X7R: l∆C/Cl: ≤ 15%

NP0: D.F.: 2 × initial value max.

X7R ≥ 100 V: D.F. ≤ 5%

NP0: R

ins

≥ 2,500 MΩ or R

ins

× C

≥ 25 seconds, whichever is less

X7R: R

ins

≥ 500 MΩ or R

ins

× C

≥

25 seconds, whichever is less

Table 10 Test condition, procedure and requirements (continued)

ww.yageo.com

Sep 08, 2005 V.0

Mid-voltage

Surface-Mount Ceramic Multilayer Capacitors

NP0/X7R

100 V to 500 V

Product specification

TEST TEST METHOD PROCEDURE REQUIREMENTS

Endurance

IEC 60384-

21/22

4.14

Preconditioning;

Initial measurements; after 150 +0/-10 °C for 1 hour,

then keep for 24 ±1 hours at room temperature

Duration and conditions: 1,000 ±12 hours at upper

category temperature with 1.5 × U

voltage applied

Final measurement: perform a heat treatment at 150

+0/–10 °C for 1 hour, final measurements shall be

carried out 24 ±1 hours after recovery at room

temperature without load.

NP0: l∆C/Cl: ≤ 2% or 1 pF whicheve

is greater

X7R: l∆C/Cl: ≤ 15%

NP0: D.F.: 2 × initial value max.

X7R ≥ 100 V: D.F. ≤ 5%

NP0: R

ins

≥ 4,000 MΩ or R

ins

× C

≥

40 seconds, whichever is less

X7R: R

ins

≥ 1,000 MΩ or R

ins

× C

≥

50 seconds, whichever is less

Table 10 Test condition, procedure and requirements (continued)

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P16

CC1206JRNPOBBN101

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Description:

Multilayer Ceramic Capacitors MLCC - SMD/SMT 100pF 500V NPO 5%

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CC1206JRNPOBBN101

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