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Y163033R0000F9R

P1-P3P4-P5
www.vishayfoilresistors.com
1
VFCP Series (Z-Foil) (0805, 1206, 1506, 2010, 2512)
For any questions, contact
foil@vpgsensors.com
Document No.: 63106
Revision: 19-Oct-2015
Ultra High-Precision Z-Foil Flip Chip Resistor
VFCP Series (Z-Foil)
(0805, 1206, 1506, 2010, 2512)
Ultra High-Precision Z-Foil Flip Chip Resistor
with TCR of ±0.2 ppm/°C, 35% Space Saving vs. Wraparound Design
and PCR of 5 ppm at Rated Power
Document No.: 63106
Revision: 19-Oct-2015
FEATURES
• Temperature coefficient of resistance (TCR):
± 0.2 ppm/°C typical (–55°C to +125°C, +25°C ref.)
• Tolerance: to ±0.01% (100 ppm)
• Power coefficient “∆R due to self heating” 5 ppm at
rated power
• Load-life stability (70°C for 2000 h): ±0.005% (50 ppm)
• Power rating to: 600 mW at +70°C
• Electrostatic discharge (ESD): at least to 25 kV
• Resistance range: 5 Ω to 125 kΩ (for lower and higher
values, please contact us)
• Bulk Metal
®
Foil resistors are not restricted to standard
values; specific “as required” values can be supplied at
no extra cost or delivery (e.g., 1K2345 vs. 1K)
• Non-inductive, non-capacitive design
• Thermal stabilization time: <1 s (within 10 ppm of
steady state value)
• Short time overload: ≤0.005% (50 ppm)
• Non hot spot design
• Rise time: 1 ns effectively no ringing
• Current noise: <0.010 μV
rms
/ V of applied voltage
(<–40 dB)
• Voltage coefficient: <0.1 ppm/V
• Non-inductive: <0.08 μH
• Terminal finishes available: lead (Pb)-free, tin/lead alloy
• Compliant to RoHS directive 2002/95/EC*
• Matched sets are available per request
• Rapid prototype sample quantities are available.
For more information, please contact us at
foil@vpgsensors.com
INTRODUCTION
Based on VFR’s Bulk Metal Z-Foil technology, the VFCP
Series (foil resistor flip-chip) excels over all previous
stability standards for precision resistors with an order
of magnitude improvement in high-temperature stability,
load-life stability, and moisture resistance. These new
benchmark levels of performance provide design
engineers with the tools to build circuits not previously
achievable while reducing costs and space in the most
critical applications by eliminating the need for corrective
circuitry and reducing the large land patterns needed
for a wrap-around configuration. The device’s flip-chip
configuration saves up to 35% PCB space compared with
a surface-mount chip with wraparound terminations while
also providing better strain relief to eliminate cracked
substrates and board delamination.
In addition to its remarkably improved load-life stability,
the VFCP Series is noise-free and provides ESD
protection of 25 kV or more for increased reliability. The
device’s solid element alloy is matched to the substrate,
forming a single entity with balanced resistance versus
temperature characteristics for an unusually low and
predictable TCR over a wide temperature range from
–55°C to more than +125°C. The adhesive that holds the
foil to the flat substrate withstands high temperatures,
pulsing power, moisture incursions, shock and vibration,
and low-temperature exposure while still holding securely
to the foil element. Resistance patterns are photo-etched
into the element to permit the trimming of resistance
values to very tight tolerances as low as 0.01%.
The Flip Chips devices are qualified as anti-sulfurated
resistors for use in environments with high levels of
contamination. Such environments include alternative
energy applications, industrial control systems,
sensors, RTDs, electric instrumentation, weather and
communication base stations, and any electronic
appliance used in high concentrations of sulfur. The
combination of flip-chip terminations and Z-Foil
construction and materials results in the most stable
resistors available, requiring the lowest error allowance.
This means that more error allowance can be transferred
to active devices—resulting in lower costs—or applied
to the foil resistors themselves, allowing for looser initial
tolerances than would be required for other resistor
technologies.
RELATED VIDEO
Refer to Bulk Metal® Foil Resistor TCR Performance
(Product Demo).
* This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example,
parts with lead (Pb) terminations are not RoHS compliant. Please see the information/tables in this datasheet for details.
www.vishayfoilresistors.com
2
VFCP Series (Z-Foil) (0805, 1206, 1506, 2010, 2512)
For any questions, contact
foil@vpgsensors.com
Document No.: 63106
Revision: 19-Oct-2015
TABLE 1—TOLERANCE AND TCR VS.
RESISTANCE VALUE
Resistance
Value
(Ω)
Tolerance
(%)
Typical TCR and Max. Spread
(–55°C to +125°C, +25°C Ref.)
(ppm/°C)
250 to 125k ±0.01% ±0.2 ±1.6
100 to <250 ±0.02% ±0.2 ±1.6
50 to <100 ±0.05% ±0.2 ±1.8
25 to <50 ±0.1% ±0.2 ±2.8
10 to <25 ±0.25% ±0.2 ±2.8
5 to <10 ±0.5% ±0.2 ±7.8
FIGURE 1—POWER DERATING CURVE
100
75
50
25
0
–75 –50 –25 0 +25 +50 +75 +100 +125 +150 +175
Ambient Temperature (°C)
Percent of Rated Powe
r
+70°C
–55°C
FIGURE 2—NOMINAL
RESISTANCE/TEMPERATURE CURVE
+500
+200
+100
0
–100
–200
–300
–500
Ambient Temperature (°C) and TCR Chord Slopes
for Different Temperature Ranges
∆
R
R
(ppm)
0.05 ppm/°C
- 0.1 ppm/°C 0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C- 0.16 ppm/°C
–400
+300
+400
–55 –25 0 +25 +60 +75 +100 +125
Note
The TCR values for <100 Ω are influenced by the termination
composition and result in deviation from this curve.
FIGURE 3—TRIMMING TO VALUES
(conceptual illustration)
Mutual
inductance
reduction
due to change
in current
direction
Current path
before trimming
Foil shown in black, etched spaces in white
Interloop
capacitance
reduction
in series
Trimming process
removes this material
from shorting strip area
changing current path
and increasing
resistance
Current path after trimming
Note
To acquire a precision resistance value, the Bulk Metal Foil
chip is trimmed by selectively removing built-in “shorting bars.”
To increase the resistance in known increments, marked
areas are cut, producing progressively smaller increases in
resistance. This method reduces the effect of “hot spots” and
improves the long-term stability of VFR resistors.
TABLE 2—MODEL SELECTION
Chip
Size
Rated Power
at +70°C
(mW)
Maximum
Voltage Rating
(≤√P × R)
Resistance
Range
(Ω)
Max.
Weight
(mg)
0805 100 mW 28 V 5 to 8k 5.2
1206 250 mW 79 V 5 to 25k 10.3
1506 300 mW 95 V 5 to 30k 12
2010 400 mW 167 V 5 to 70k 25
2512 600 mW 220 V 5 to 125k 35
TABLE 3—LOAD-LIFE STABILITY
(+70°C for 2000 h)
Chip Size MAXIMUM ∆R LIMITS
0805
±0.005% at 50 mW
±0.01% at 100 mW
1206
±0.005% at 150 mW
±0.01% at 250 mW
1506
±0.005% at 150 mW
±0.01% at 300 mW
2010
±0.005% at 200 mW
±0.01% at 400 mW
2512
±0.005% at 500 mW
±0.01% at 600 mW
VFCP Series (Z-Foil)
(0805, 1206, 1506, 2010, 2512)
www.vishayfoilresistors.com
3
VFCP Series (Z-Foil) (0805, 1206, 1506, 2010, 2512)
For any questions, contact
foil@vpgsensors.com
Document No.: 63106
Revision: 19-Oct-2015
TABLE 4—PERFORMANCE SPECIFICATIONS
Test or Condition
MIL-PRF-55342
Characteristic E ∆R Limits
Typical ∆R Limits Maximum ∆R Limits
(1)
Thermal Shock
±0.1% ±0.005% (50 ppm) ± 0.01% (100 ppm)
Low Temperature Operation
±0.1% ±0.005% (50 ppm) ± 0.01% (100 ppm)
Short Time Overload
±0.1% ±0.005% (50 ppm) ± 0.01% (100 ppm)
High Temperature Exposure
±0.1% ±0.01% (100 ppm) ±0.02% (200 ppm)
Resistance to Soldering Heat
±0.2% ±0.005% (50 ppm) ±0.015% (150 ppm)
Moisture Resistance
±0.2% ±0.005% (50 ppm) ±0.03% (300 ppm)
Load Life Stability +70°C for
2000 hours at Rated Power
±0.5% ±0.005% (50 ppm) ±0.01% (100 ppm)
Note
(1) As shown +0.01 ohms (Ω) to allow for measurement errors at low values.
TABLE 5—DIMENSIONS AND LAND PATTERN in inches (millimeters)
D
W
L
L1 (L - 0.005")
W1 (W - 0.003")
Solder Terminals
BOTTOM VIEW (showing terminals for mounting) LAND PATTERN
G
Z
X
Chip
Size
L
±0.005 (0.13)
W
±0.005 (0.13)
Thickness
Maximum
D
±0.005 (0.13)
Z G X
0805 0.079 (2.01) 0.049 (1.24) 0.025 (0.64) 0.010 (0.25) 0.078 (1.98) 0.053 (1.35) 0.049 (1.24)
1206 0.126 (3.20) 0.062 (1.57) 0.025 (0.64) 0.015 (0.38) 0.125 (3.18) 0.090 (2.29) 0.062 (1.57)
1506
0.150 (3.81) 0.062 (1.57) 0.025 (0.64) 0.012 (0.30) 0.150 (3.81) 0.120 (3.05) 0.062 (1.57)
2010 0.200 (5.08) 0.100 (2.54) 0.025 (0.64) 0.020 (0.51) 0.199 (5.05) 0.153 (3.89) 0.100 (2.54)
2512
0.250 (6.35) 0.126 (3.20) 0.025 (0.64) 0.024 (0.61) 0.250 (6.35) 0.196 (4.98) 0.126 (3.20)
Notes
Avoid the use of those cleaning agents that could attack epoxy resins, which form part of the resistor construction.
Vacuum pick-up is recommended for handling.
Soldering iron not recommended.
RELATED PRODUCT TRAINING MODULE
Refer to Precision Resistors—There is more to resistor
precision than meets the eye.
RELATED VIDEO
Refer to Bulk Metal® Foil Resistor Accelerated Life Test
(Product Demo).
HARMONIC DISTORTION
Harmonic distortion is an important consideration in the
choice of precision resistors for sensitive applications. A
significant signal voltage across the resistor may change
the resistance value depending on the construction,
material, and size. Under these conditions Bulk Metal Foil
resistors behave more linearly than other resistor types.
FLOWER OF SULFUR
ASTM B 809, also known as flower of sulfur, is a test to
determine the porosity of metallic coating using humid
sulfur vapor. This vapor can penetrate conformal coatings
and cause damage to the device when it reacts with
lower layers of silver. Surface-mount Bulk Metal Foil chip
resistors avoid this problem with a special coating that
is proven to be reliable in extreme environments and
even against sulfur. The flower of sulfur test is especially
VFCP Series (Z-Foil)
(0805, 1206, 1506, 2010, 2512)
P1-P3P4-P5

Y163033R0000F9R

Mfr. #:
Buy Y163033R0000F9R
Manufacturer:
Vishay Precision Group
Description:
RES SMD 33 OHM 1% 1/4W 1206
Lifecycle:
New from this manufacturer.
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