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TFA9843J/N1,112

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21
Philips Semiconductors
TFA9843J
2-channel audio amplifier (2 x SE or 1 x BTL)
Preliminary data Rev. 02 — 19 January 2004 16 of 21
9397 750 12587
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
At V
CC
=18VandR
L
=4Ω (2 × SE) the measured worst-case sine-wave dissipation
is 8.4 W; see Figure 13. For T
j(max)
= 150 °C the temperature raise, caused by the
power dissipation, is: 150 − 60=90°C:
P × R
th(tot)
=90°C
R
th(tot)
= 90/8.4 = 10.7 K/W
R
th(h-a)
=R
th(tot)
− R
th(j-mb)
= 10.7 − 2.0 = 8.7 K/W
This calculation is for an application at worst-case (stereo) sine-wave output signals.
In practice music signals will be applied, which decreases the maximum power
dissipation to approximately half of the sine-wave power dissipation (see
Section 8.2.2). This allows for the use of a smaller heatsink:
P × R
th(tot)
=90°C
R
th(tot)
= 90/4.2 = 21.4 K/W
R
th(h-a)
=R
th(tot)
− R
th(j-mb)
= 21.4 − 2.0 = 19.4 K/W
14. Test information
14.1 Quality information
The
General Quality Specification for Integrated Circuits, SNW-FQ-611
is applicable.
2 × SE loads; T
amb
=25°C; external heatsink of 10 K/W;
music signals.
BTL loads; T
amb
=25°C; external heatsink of 10 K/W;
music signals.
Fig 22. Junction temperature versus supply voltage. Fig 23. Junction temperature versus supply voltage.
8
150
100
50
0
12 28
V
CC
(V)
16 20 24
MCE504
T
j
(˚C)
R
L
= 2 Ω 4 Ω 6 Ω 8 Ω
16 Ω
8
150
100
50
0
12 28
V
CC
(V)
16 20 24
MCE505
T
j
(˚C)
2 Ω 3 Ω 4 Ω
8 Ω
R
L
= 1 Ω
Philips Semiconductors
TFA9843J
2-channel audio amplifier (2 x SE or 1 x BTL)
Preliminary data Rev. 02 — 19 January 2004 17 of 21
9397 750 12587
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
15. Package outline
Fig 24. DBS9P package outline.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D
1
may protrude 0.04 mm maximum.
SOT523-1
0 10 mm5
scale
w M
b
p
D
h
q
1
Z
19
e
e
1
m
e
2
x
A
2
non-concave
D
1
D
P
k
q
2
L
3
L
2
L
Qc
E
00-07-03
03-03-12
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
view B: mounting base side
B
UNIT b
p
L
1
cD
(1)
D
h
Lq
2
mm
2.7
2.3
A
2
(2)
0.80
0.65
0.58
0.48
13.2
12.8
D
1
(2)
6.2
5.8
3.5
E
h
3.5
e
2.54
e
1
1.27
e
2
5.08 4.85
QE
(1)
14.7
14.3
Z
(1)
1.65
1.10
11.4
10.0
L
2
6.7
5.5
L
3
4.5
3.7
3.4
3.1
1.15
0.85
q
17.5
16.3
q
1
2.8
m
0.8
v
3.8
3.6
3
2
12.4
11.0
Pk
0.02
x
0.3
w
E
h
L
1
q
v M
Philips Semiconductors
TFA9843J
2-channel audio amplifier (2 x SE or 1 x BTL)
Preliminary data Rev. 02 — 19 January 2004 18 of 21
9397 750 12587
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.
16.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
Table 11: Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Package Soldering method
Dipping Wave
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable
[1]
PMFP
[2]
− not suitable
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21

TFA9843J/N1,112

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Manufacturer:
NXP Semiconductors
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IC AMP AUDIO PWR 29W STER 9SIL
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