LQH44PN2R2NGRL

SpecNo.JELF243A-0120E-01 P.4/7
MURATA MFG.CO., LTD
Reference Only
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.2 to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape(cover tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
()
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,
Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
W
D
Label
H
190 min
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
210 min
φ
60±
13±1.4
φ
180
±
0
3
1
0
(in mm)
Trailer
:
160 min.
Direction of feed
Empty tape
Leader
Cover tape
Label
0
1
165 to 180 degree
F
Cover tape
Plastic tape
SpecNo.JELF243A-0120E-01 P.5/7
MURATA MFG.CO., LTD
Reference Only
11. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability
may be affected, or result to "position shift" in soldering process.
(in mm)
11.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
11.3 soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to
100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product
quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 time
Limit Profile
Standard Profile
90s±30s
230
260
245℃±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
SpecNo.JELF243A-0120E-01 P.6/7
MURATA MFG.CO., LTD
Reference Only
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Times 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to
the thermal shock.
11.5 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be located in the sideways
direction to the mechanical stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A > D 1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from
the board separation surface.
A > C
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
Poor example
(Good example)
Electrode
Electrode
Slit
Seam
A
D
B
C
Electrode
Electrode
Screw Hole
Recommended

LQH44PN2R2NGRL

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 1515 2.2uH 30% 2.0A 45MHz(SRF)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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