NTLUS3A39PZ
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6
PACKAGE DIMENSIONS
UDFN6 1.6x1.6, 0.5P
CASE 517AU
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
D2
E2
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
NOTE 4
A
A1
(A3)
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L
6X
1
3
46
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.20 0.30
D 1.60 BSC
D2 0.15 0.25
E 1.60 BSC
E2 0.57 0.67
e 0.50 BSC
L 0.20 0.30
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOUNTING FOOTPRINT*
L1
DETAIL A
A1
A3
DETAIL B
OPTIONAL
MOLD CMPD
EXPOSED Cu
L
CONSTRUCTION
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
0.82
0.43
0.50 PITCH
0.35
2X
1.90
DIMENSIONS: MILLIMETERS
0.32
1
6X
SOLDERMASK DEFINED
L1 −−− 0.15
F 0.55 BSC
G 0.25 BSC
D1 0.62 0.72
D1
G
F
0.10 B
AC
0.10 BAC
0.16
0.28
0.68
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