MC100LVEP210FAG

© Semiconductor Components Industries, LLC, 2014
May, 2014 − Rev. 15
1 Publication Order Number:
MC100LVEP210/D
MC100LVEP210
2.5V / 3.3V 1:5 Dual
Differential ECL/PECL/HSTL
Clock Driver
Description
The MC100LVEP210 is a low skew 1−to−5 dual differential driver,
designed with clock distribution in mind. The ECL/PECL input
signals can be either differential or single−ended if the V
BB
output is
used. The signal is fanned out to 5 identical differential outputs. HSTL
inputs can be used when the EP210 is operating in PECL mode.
The LVEP210 specifically guarantees low output−to−output skew.
Optimal design, layout, and processing minimize skew within a device
and from device to device.
To ensure the tight skew specification is realized, both sides of the
differential output need to be terminated identically into 50 W even if
only one output is being used. If an output pair is unused, both outputs
may be left open (unterminated) without affecting skew.
The MC100LVEP210, as with most other ECL devices, can be
operated from a positive V
CC
supply in PECL mode. This allows the
LVEP210 to be used for high performance clock distribution in +3.3 V
or +2.5 V systems. Single−ended CLK input operation is limited to a
V
CC
3.0 V in PECL mode, or V
EE
−3.0 V in ECL mode.
Designers can take advantage of the LVEP210’s performance to
distribute low skew clocks across the backplane or the board. In a
PECL environment, series or Thevenin line terminations are typically
used as they require no additional power supplies. For more
information on using PECL, designers should refer to Application
Note AN1406/D.
Features
85 ps Typical Device−to−Device Skew
20 ps Typical Output−to−Output Skew
V
BB
Output
Jitter Less than 1 ps RMS
350 ps Typical Propagation Delay
Maximum Frequency u 3 GHz Typical
The 100 Series Contains Temperature Compensation
PECL and HSTL Mode Operating Range: V
CC
= 2.375 V to 3.8 V
with V
EE
= 0 V
NECL Mode Operating Range: V
CC
= 0 V
with V
EE
= −2.375 V to −3.8 V
Open Input Default State
LVDS Input Compatible
Fully Compatible with MC100EP210
These are Pb−Free Devices
32−LEAD LQFP
FA SUFFIX
CASE 873A
MARKING
DIAGRAMS*
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G or G = Pb−Free Package
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*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
MC100
LVEP21
AWLYYWWG
32
1
MC100
LVEP210
AWLYYWWG
G
1
QFN32
MN SUFFIX
CASE 488AM
(Note: Microdot may be in either location)
MC100LVEP210
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2
CLKn*, CLKn
** ECL/PECL/HSTL CLK Inputs
V
BB
Reference Voltage Output
V
CC
25
26
27
28
29
30
31
32
15
14
13
12
11
10
9
12345678
24 23 22 21 20 19 18 17
16
Qb4 Qb4Qb3 Qb3 Qb2 Qb2 V
CC
V
CC
Qa0 Qa0 Qa1 Qa1 Qa2 Qa2 V
CC
V
EE
V
BB
V
CC
Qb1
Qb1
Qb0
Qb0
Qa4
Qa4
Qa3
Qa3
Qa0
Qa0
Qa1
Qa1
Qa2
Qa2
Qa3
Qa3
Qa4
Qa4
V
BB
CLKa
CLKa
NC
Qb0
Qb0
Qb1
Qb1
Qb2
Qb2
Qb3
Qb3
Qb4
Qb4
CLKb
CLKb
Warning: All V
CC
and V
EE
pins must be externally connected
to Power Supply to guarantee proper operation.
PIN
Qn0:4, Qn0:4
ECL/PECL Outputs
FUNCTION
V
CC
Positive Supply
V
EE
Negative Supply
* Pins will default LOW when left open.
** Pins will default to V
CC
/2 when left open.
MC100LVEP210
CLKa
CLKa
CLKb
CLKb
V
EE
V
CC
Table 1. PIN DESCRIPTION
2526272829303132
1514131211109
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
16
Figure 1. 32−Lead QFN Pinout (Top View)
MC100LVEP210
V
CC
Qb4 Qb4Qb3 Qb3 Qb2 Qb2 V
CC
V
CC
Qa0 Qa0 Qa1 Qa1 Qa2 Qa2 V
CC
V
EE
V
BB
V
CC
Qb1
Qb1
Qb0
Qb0
Qa4
Qa4
Qa3
Qa3
NC
CLKa
CLKa
CLKb
CLKb
Figure 2. LQFP−32 Pinout (Top View)
Figure 3. Logic Diagram
EP The exposed pad (EP) on the QFN−32 package bottom is thermally connected to the die for im-
proved heat transfer out of the package. THe exposed pad must be attached to a heat−sinking
conduit. The pad is electrically connected to V
EE
.
Exposed Pad
(EP)
MC100LVEP210
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3
Table 2. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pull−up Resistor
37.5 kW
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 100 V
> 2 kV
Moisture Sensitivity (Note 1) Pb Pkg Pb−Free Pkg
LQFP−32
QFN−32
Level 2
N/A
Level 2
Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 461 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
PECL Mode Power Supply V
EE
= 0 V 6 V
V
EE
NECL Mode Power Supply V
CC
= 0 V −6 V
V
I
PECL Mode Input Voltage
NECL Mode Input Voltage
V
EE
= 0 V
V
CC
= 0 V
V
I
V
CC
V
I
V
EE
6
−6
V
V
I
out
Output Current Continuous
Surge
50
100
mA
mA
I
BB
V
BB
Sink/Source ± 0.5 mA
T
A
Operating Temperature Range −40 to +85 °C
T
stg
Storage Temperature Range −65 to +150 °C
q
JA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
LQFP−32
LQFP−32
80
55
°C/W
°C/W
q
JC
Thermal Resistance (Junction−to−Case) Standard Board LQFP−32 12 to 17 °C/W
q
JA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
QFN−32
QFN−32
31
27
°C/W
°C/W
q
JC
Thermal Resistance (Junction−to−Case) 2S2P QFN−32 12 °C/W
T
sol
Wave Solder Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

MC100LVEP210FAG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer 2.5V/3.3V 1:5 Dual ECL/PECL/HST Driver
Lifecycle:
New from this manufacturer.
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