Data Sheet ADG884
Rev. D | Page 15 of 16
SEATING
PLANE
0.50 BSC
BALL PITCH
1.56
1.50
1.44
0.26
0.22
0.18
0.11
0.09
0.07
0.36
0.32
0.28
0.63
0.57
0.51
BOTTOM
VIEW
(BALL SIDE UP)
2.06
2.00
1.94
TOP VIEW
(BALL SIDE DOWN)
A
123
B
C
D
BALL 1
IDENTIFIE
081607-A
Figure 30. 10-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
2
ADG884BRMZ −40°C to +85°C 10-Lead Mini Small Outline Package [MSOP] RM-10 S9C
ADG884BRMZ-REEL −40°C to +85°C 10-Lead Mini Small Outline Package [MSOP] RM-10 S9C
ADG884BRMZ-REEL7 −40°C to +85°C 10-Lead Mini Small Outline Package [MSOP] RM-10 S9C
ADG884BCPZ-REEL −40°C to +85°C 10-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-10-9 S9C
ADG884BCPZ-REEL7 −40°C to +85°C 10-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-10-9 S9C
ADG884BCBZ-REEL −40°C to +85°C 10-Ball Wafer Level Chip Scale Package [WLCSP] CB-10 S9C
ADG884BCBZ-REEL7 −40°C to +85°C 10-Ball Wafer Level Chip Scale Package [WLCSP] CB-10 S9C
EVAL-ADG884EBZ Evaluation Board
1
Z = RoHS Compliant Part.
2
Branding on this package is limited to three characters due to space constraints.
