MC74VHC1G03DTT1

© Semiconductor Components Industries, LLC, 2007
January, 2007 − Rev. 14
1 Publication Order Number:
MC74VHC1G03/D
MC74VHC1G03
Single 2−Input NOR Gate
with Open Drain Output
The MC74VHC1G03 is an advanced high speed CMOS 2−input
NOR gate with an open drain output fabricated with silicon gate
CMOS technology.
The internal circuit is composed of multiple stages, including an
open drain output which provides the capability to set output
switching level. This allows the MC74VHC1G03 to be used to
interface 5 V circuits to circuits of any voltage between V
CC
and 7 V
using an external resistor and power supply.
The MC74VHC1G03 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage.
Features
High Speed: t
PD
= 3.6 ns (Typ) at V
CC
= 5 V
Low Internal Power Dissipation: I
CC
= 1 mA (Max) at T
A
= 25°C
Power Down Protection Provided on Inputs
Pin and Function Compatible with Other Standard Logic Families
Chip Complexity: FETs = 62
Pb−Free Packages are Available
V
CC
IN B
IN A
OUT Y
GND
IN A
IN B
OUT Y
1
OVT
Figure 1. Pinout (Top View)
Figure 2. Logic Symbol
1
2
3
5
4
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MARKING
DIAGRAMS
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
VP = Device Code
M = Date Code*
G = Pb−Free Package
SC−88A / SOT−353 / SC−70
DF SUFFIX
CASE 419A
TSOP−5 / SOT−23 / SC−59
DT SUFFIX
CASE 483
VP M G
G
L
L
H
H
L
H
L
H
FUNCTION TABLE
Inputs Output
AB
Z
L
L
L
Y
PIN ASSIGNMENT
1
2
3 GND
IN B
IN A
4
5V
CC
OUT Y
1
5
VP M G
G
M
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
MC74VHC1G03
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2
MAXIMUM RATINGS
Symbol Characteristics Value Unit
V
CC
DC Supply Voltage −0.5 to +7.0 V
V
IN
DC Input Voltage −0.5 to +7.0 V
V
OUT
DC Output Voltage V
CC
= 0
High or Low State
−0.5 to 7.0
−0.5 to V
CC
+ 0.5
V
I
IK
Input Diode Current −20 mA
I
OK
Output Diode Current V
OUT
< GND; V
OUT
> V
CC
+20 mA
I
OUT
DC Output Current, per Pin +25 mA
I
CC
DC Supply Current, V
CC
and GND +50 mA
P
D
Power Dissipation in Still Air at 85°C SC70−5/SC−88A
TSOP−5
150
200
mW
q
JA
Thermal Resistance SC705/SC−88A (Note 1)
TSOP−5
350
230
°C/W
T
L
Lead Temperature, 1 mm from Case for 10 Seconds 260 °C
T
J
Junction Temperature Under Bias )150 °C
T
STG
Storage Temperature Range *65 to )150 °C
MSL Moisture Sensitivity Level 1
F
R
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 125°C (Note 5) $500 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
V
CC
DC Supply Voltage 2.0 5.5 V
V
IN
DC Input Voltage 0.0 5.5 V
V
OUT
DC Output Voltage 0.0 7.0 V
T
A
Operating Temperature Range −55 +125 °C
t
r
, t
f
Input Rise and Fall Time V
CC
= 3.3 V ± 0.3 V
V
CC
= 5.0 V ± 0.5 V
0
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C Time, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
1
1 10 100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
NORMALIZED FAILURE RATE
TIME, YEARS
T
J
= 130°C
T
J
= 120°C
T
J
= 110°C
T
J
= 100°C
T
J
= 90°C
T
J
= 80°C
MC74VHC1G03
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3
DC ELECTRICAL CHARACTERISTICS
V
CC
T
A
= 25°C T
A
85°C −55 T
A
125°C
Symbol Parameter Test Conditions (V) Min Typ Max Min Max Min Max Unit
V
IH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
5.5
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
V
V
IL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
5.5
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
V
V
OL
Maximum Low−Leve
l
Output Voltage
V
IN
= V
IH
or V
IL
V
IN
= V
IH
or V
IL
I
OL
= 50 mA
2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
V
IN
= V
IH
or V
IL
I
OL
= 4 mA
I
OL
= 8 mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
I
LKG
Z−State Output
Leakage Current
V
IN
= V
IL
V
OUT
= V
CC
or GND
5.5 $5 $10 $10
mA
I
IN
Maximum Input
Leakage Current
V
IN
= 5.5 V or GND 0 to
5.5
±0.1 ±1.0 ±1.0
mA
I
CC
Maximum Quiescent
Supply Current
V
IN
= V
CC
or GND 5.5 1.0 20 40
mA
I
OFF
Power Off−Output
Leakage Current
V
OUT
= 5.5 V
V
IN
= 5.5 V
0 0.25 2.5 5
mA
AC ELECTRICAL CHARACTERISTICS Input t
r
= t
f
= 3.0 ns
Symbol Parameter Test Conditions
T
A
= 25°C T
A
85°C −55 T
A
125°C
Unit
Min Typ Max Min Max Min Max
t
PZL
Maximum Outpu
t
Enable Time,
Input A or B to Y
V
CC
= 3.3 ± 0.3 V C
L
= 15 pF
R
L
= R
I
= 500 W C
L
= 50 pF
5.6
8.1
7.9
11.4
9.5
13.0
11.0
15.5
ns
V
CC
= 5.0 ± 0.5 V C
L
= 15 pF
R
L
= R
I
= 500 W C
L
= 50 pF
3.6
5.1
5.5
7.5
6.5
8.5
8.0
10.0
t
PLZ
Maximum Outpu
t
Disable Time
V
CC
= 3.3 ± 0.3 V C
L
= 50 pF
R
L
= R
I
= 500 W
8.1 11.4 13.0 15.5 ns
V
CC
= 5.0 ± 0.5 V C
L
= 50 pF
R
L
= R
I
= 500 W
5.1 7.5 8.5 10.0
C
IN
Maximum Input
Capacitance
4 10 10 10 pF
C
PD
Power Dissipation Capacitance (Note 6)
Typical @ 25°C, V
CC
= 5.0V
pF
18
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC
2
f
in
+ I
CC
V
CC
.

MC74VHC1G03DTT1

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Logic Gates 2-5.5V Single NOR
Lifecycle:
New from this manufacturer.
Delivery:
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