BSZ076N06NS3GATMA1

Type
BSZ076N06NS3 G
OptiMOS
TM
3 Power-Transistor
Features
• Ideal for high frequency switching and sync. rec.
• Optimized technology for DC/DC converters
• Excellent gate charge x R
DS(on)
product (FOM)
• Very low on-resistance R
DS(on)
• N-channel, normal level
• 100% avalanche tested
• Pb-free plating; RoHS compliant
• Qualified according to JEDEC
1)
for target applications
• Halogen-free according to IEC61249-2-21
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current
I
D
V
GS
=10 V, T
C
=25 °C
2)
20 A
V
GS
=10 V, T
C
=100 °C
20
V
GS
=10 V, T
C
=25 °C,
R
thJA
=50K/W J41
3)
14
Pulsed drain current
4)
I
D,pulse
T
C
=25 °C
80
Avalanche energy, single pulse
5)
E
AS
I
D
=20 A, R
GS
=25
118 mJ
Gate source voltage
V
GS
±20 V
2)
Current is limited by bondwire; with an R
thJC
=1.8 K/W the chip is able to carry 75A.
5)
See figure 13 for more detailed information
3)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Value
1)
J-STD20 and JESD22
4)
See figure 3 for more detailed information
V
DS
60 V
R
DS(on),max
7.6
m
I
D
20 A
Product Summary
Type
BSZ076N06NS3 G
Package
PG-TSDSON-8
Marking
076N06N
Rev.2.4 page 1 2009-11-11
BSZ076N06NS3 G
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Power dissipation
P
tot
T
C
=25 °C
69 W
T
A
=25 °C,
R
thJA
=60 K/W
3)
2.1
Operating and storage temperature
T
j
, T
stg
-55 ... 150 °C
IEC climatic category; DIN IEC 68-1 55/150/56
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case
R
thJC
- - 1.8 K/W
Device on PCB
R
thJA
minimal footprint - - -
6 cm² cooling area
3)
--60
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0 V, I
D
=1 mA
60 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=35 µA
234
Zero gate voltage drain current
I
DSS
V
DS
=60 V, V
GS
=0 V,
T
j
=25 °C
- 0.1 1 µA
V
DS
=60 V, V
GS
=0 V,
T
j
=125 °C
- 10 100
Gate-source leakage current
I
GSS
V
GS
=20 V, V
DS
=0 V
- 10 100 nA
R
DS(on)
V
GS
=10 V, I
D
=20 A
- 6.1 7.6
m
Gate resistance
R
G
-1-
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=20 A
20 39 - S
Value
Values
Drain-source on-state resistance
Rev.2.4 page 2 2009-11-11
BSZ076N06NS3 G
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
Input capacitance
C
iss
- 3000 4000 pF
Output capacitance
C
oss
- 660 880
Reverse transfer capacitance
C
rss
-24-
Turn-on delay time
t
d(on)
-15-ns
Rise time
t
r
-40-
Turn-off delay time
t
d(off)
-20-
Fall time
t
f
-5-
Gate Char
g
e Characteristics
6)
Gate to source charge
Q
gs
-15-nC
Gate charge at threshold
Q
g(th)
-9-
Gate to drain charge
Q
gd
-3-
Switching charge
Q
sw
-9-
Gate charge total
Q
g
-3750
Gate plateau voltage
V
plateau
- 4.9 - V
Output charge
Q
oss
V
DD
=30 V, V
GS
=0 V
-3040
Reverse Diode
Diode continuous forward current
I
S
- - 20 A
Diode pulse current
I
S,pulse
--80
Diode forward voltage
V
SD
V
GS
=0 V, I
F
=20 A,
T
j
=25 °C
- 0.85 1.2 V
Reverse recovery time
t
rr
-36-ns
Reverse recovery charge
Q
rr
-32-nC
6)
See figure 16 for gate charge parameter definition
T
C
=25 °C
Values
V
GS
=0 V, V
DS
=30 V,
f =1 MHz
V
DD
=30 V, V
GS
=10 V,
I
D
=20 A, R
G
=3.5
V
DD
=30 V, I
D
=20 A,
V
GS
=0 to 10 V
V
R
=30 V, I
F
=20A ,
di
F
/dt =100 A/µs
Rev.2.4 page 3 2009-11-11

BSZ076N06NS3GATMA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MV POWER MOS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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