MAX3942
10Gbps Modulator Driver
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10
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Package Information
For the latest package outline information, go to
www.maxim-ic.com/packages
.
Revision History
Pages changed at Rev 1: 1, 2, 10.
Exposed-Pad Package
The exposed pad on the 24-pin QFN provides a very
low thermal resistance path for heat removal from the
IC. The pad is also electrical ground on the MAX3942
and must be soldered to the circuit board ground for
proper thermal and electrical performance. Refer to
Maxim Application Note
HFAN-08.1: Thermal
Considerations of QFN and Other Exposed-Paddle
Packages
for additional information.
Figure 6. Simplified Output Circuit
MAX3942
50Ω 50Ω
OUT+
GND
V
EE
OUT-
GND
V
EE
GND GND
Chip Information
TRANSISTOR COUNT: 1918
PROCESS: SiGe Bipolar
24
23
22
21
20
19
7
8
9
10
11
12
13
14
15
16
17
18
6
5
4
3
2
1
MAX3942
24 THIN QFN (4mm x 4mm)
TOP VIEW
DATA+
DATA-
GND
GND
CLK+
CLK-
EXPOSED PAD CONNECTED TO GROUND
V
EE
RTEN
MODEN
V
EE
PLRT
V
EE
V
EE
GND
OUT+
OUT-
GND
V
EE
V
EE
V
EE
MODSET
PWC-
PWC+
V
EE.
Pin Configuration
PART PACKAGE TYPE PACKAGE CODE
MAX3942ETG
24 Thin QFN
(4mm
4mm 0.8mm)
T2444-1

MAX3942ETG+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Buffers & Line Drivers 10Gbps Modulator Driver
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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