MC74HC244ADT

MC74HC244A
http://onsemi.com
4
SWITCHING WAVEFORMS
Figure 1. Figure 2.
V
CC
GND
t
f
t
r
DATA INPUT
A OR B
OUTPUT
YA OR YB
10%
50%
90%
10%
50%
90%
t
TLH
t
PLH
t
PHL
t
THL
ENABLE
A OR B
OUTPUT Y
OUTPUT Y
50%
50%
50%
90%
10%
t
PZL
t
PLZ
t
PZH
t
PHZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
V
OH
HIGH
IMPEDANCE
TEST CIRCUITS
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 3. Test Circuit
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 4. Test Circuit
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL
.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH
.
1 kW
PIN DESCRIPTIONS
INPUTS
A1, A2, A3, A4, B1, B2, B3, B4
(Pins 2, 4, 6, 8, 11, 13, 15, 17)
Data input pins. Data on these pins appear in noninverted
form on the corresponding Y outputs, when the outputs are
enabled.
CONTROLS
Enable A, Enable B (Pins 1, 19)
Output enables (active−low). When a low level is applied
to these pins, the outputs are enabled and the devices
function as noninverting buffers. When a high level is
applied, the outputs assume the high impedance state.
OUTPUTS
YA1, YA2, YA3, YA4, YB1, YB2, YB3, YB4
(Pins 18, 16, 14, 12, 9, 7, 5, 3)
Device outputs. Depending upon the state of the
output−enable pins, these outputs are either noninverting
outputs or high−impedance outputs.
MC74HC244A
http://onsemi.com
5
LOGIC DETAIL
DATA
INPUT
A OR B
ENABLE A OR
ENABLE B
TO THREE OTHER
A OR B INVERTERS
ONE OF 8
INVERTERS
YA
OR
YB
V
CC
ORDERING INFORMATION
Device Package Shipping
MC74HC244ADWG SOIC−20 WIDE
(Pb−Free)
38 Units / Rail
MC74HC244ADWR2G SOIC−20 WIDE
(Pb−Free)
1000 / Tape & Reel
MC74HC244ADTG TSSOP−20
(Pb−Free)
75 Units / Rail
MC74HC244ADTR2G TSSOP−20
(Pb−Free)
2500 / Tape & Reel
NLV74HC244ADWR2G* SOIC−20 WIDE
(Pb−Free)
1000 / Tape & Reel
NLV74HC244ADTR2G* TSSOP−20
(Pb−Free)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
MC74HC244A
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

MC74HC244ADT

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers 2-6V Octal 3-State
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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