LTM4607
17
4607fc
For more information www.linear.com/LTM4607
applicaTions inForMaTion
V
IN
(V)
V
OUT
(V)
R
SENSE
(0.5W RATING)
Inductor
(µH)
C
IN
(CERAMIC)
C
IN
(BULK)
C
OUT1
(CERAMIC)
C
OUT2
(BULK)
I
OUT(MAX)
*
(A)
36 20 1 ×
13mΩ 0.5W 8 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 150µF 50V 8
5 24 2 × 16mΩ 0.5W 3.3 None 150µF 50V 4 × 22µF 25V 2 × 150µF 50V 2
12 24 2 × 18mΩ 0.5W 4.7 None 150µF 50V 4 × 22µF 25V 2 × 150µF 50V 5
32 24 1 × 14mΩ 0.5W 4.7 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 150µF 50V 8
36 24 1 × 13mΩ 0.5W 7 2 × 10µF 50V 150µF 50V 2 × 22µF 25V 2 × 150µF 50V 8
INDUCTOR MANUFACTURER WEBSITE PHONE NUMBER
Sumida www.sumida.com 408-321-9660
Toko www.toko.com 847-297-0070
SENSING RESISTOR MANUFACTURER WEBSITE PHONE NUMBER
Panasonic www.panasonic.com/industrial/components 949-462-1816
KOA www.koaspeer.com 814-362-5536
Vishay www.vishay.com 800-433-5700
*Maximum load current is based on the Linear Technology DC1198A at room temperature with natural convection. Poor board layout design may
decrease the maximum load current.
Table 4. Boost Mode
DERATING CURVE V
OUT
(V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK θ
JA
(°C/W)*
Figure 7, 9 12, 16 Figure 5 0 None 11.4
Figure 7, 9 12, 16 Figure 5 200 None 8.5
Figure 7, 9 12, 16 Figure 5 400 None 7.5
Figure 8, 10 12, 16 Figure 5 0 BGA Heat Sink 11.0
Figure 8, 10 12, 16 Figure 5 200 BGA Heat Sink 7.9
Figure 8, 10 12, 16 Figure 5 400 BGA Heat Sink 7.1
Table 5. Buck Mode
DERATING CURVE V
OUT
(V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK θ
JA
(°C/W)*
Figure 11, 13 12, 20 Figure 6 0 None 8.2
Figure 11, 13 12, 20 Figure 6 200 None 5.9
Figure 11, 13 12, 20 Figure 6 400 None 5.4
Figure 12, 14 12, 20 Figure 6 0 BGA Heat Sink 7.5
Figure 12, 14 12, 20 Figure 6 200 BGA Heat Sink 5.3
Figure 12, 14 12, 20 Figure 6 400 BGA Heat Sink 4.8
HEAT SINK MANUFACTURER PART NUMBER PHONE NUMBER
Wakefield Engineering LT N 20069 603-635-2800
Aavid Thermalloy 375424B00034G 603-224-9988
*The results of thermal resistance from junction to ambient θ
JA
are based on the demo board DC 1198A. Thus, the maximum temperature on board is treated
as the junction temperature (which is in the µModule for most cases) and the power losses from all components are counted for calculations. It has to be
mentioned that poor board design may increase the θ
JA
.
Table 3. Typical Components (ƒ = 400kHz)
