2001 Nov 27 10
Philips Semiconductors Product specification
UHF power LDMOS transistor BLF647
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MGW538
+
V
bias
+
V
D
C9
C8
C18
C20
C17
50
output
C19
C7
L16
C14
C11
C6
C5
C10
C13
C12
L14 R4
C16
C15
L15
R3
R2
R1
8
3
3
L6
L4
L3
L5
L8
L7
L10
L12
L13
L11
B2
L9
TR1
50
input
C1
L1
B1
C2
L2
Fig.11 Class-AB common source 800 MHz test circuit.
Dimensions in mm.
2001 Nov 27 11
Philips Semiconductors Product specification
UHF power LDMOS transistor BLF647
List of components class-AB 800 MHz test circuit (see Figs 11 and 12)
Notes
1. American Technical Ceramics type 100A or capacitor of same quality.
2. American Technical Ceramics type 180R or capacitor of same quality.
3. The striplines are on a double copper-clad printed-circuit board: Rogers 5880 (ε
r
= 2.2); thickness 0.79 mm.
COMPONENT DESCRIPTION VALUE DIMENSIONS
CATALOGUE
No.
C1, C2 multilayer ceramic chip capacitor; note 1 30 pF
C5 multilayer ceramic chip capacitor; note 1 10 pF
C6 tekelec trimmer 0.6 to 7.5 pF
C7, C8 multilayer ceramic chip capacitor; note 1 100 pF
C9 electrolytic capacitor 10 µF
C10, C11 multilayer ceramic chip capacitor; note 2 8.2 pF
C12, C13 multilayer ceramic chip capacitor; note 2 10 pF
C14 multilayer ceramic chip capacitor; note 2 4.7 pF
C15, C16 multilayer ceramic chip capacitor; note 2 100 pF
C17 multilayer ceramic chip capacitor; note 2 20 pF
C18 SMD capacitor 1 µF 2222 595 16754
C19 electrolytic capacitor 470 µF
C20 electrolytic capacitor 100 µF
L1, L2 semi rigid coax UT70-25 Z = 25 Ω±1.5 30.6 mm
L3, L4 stripline; note 3 15 × 10 mm
L5, L6 stripline; note 3 5.5 × 15 mm
L7, L8 stripline; note 3 10 × 10 mm
L9, L10 stripline; note 3 15 × 5mm
L11, L12 stripline; note 3 48.5 × 2.4 mm
L13 stripline; note 3 10 × 2.4 mm
L14 ferrite
L15, L16 Coilcraft SMD coil 1008CS-102XKBC 1 µH
B1 semi rigid coax (lambda/2) Z = 50 Ω±1.5 lambda/2
B2 semi rigid coax balun UT70-25 Z = 25 Ω±1.5 48.5 mm
R1 resistor 1 k
R2, R3 resistor 100
R4 resistor 3,3
2001 Nov 27 12
Philips Semiconductors Product specification
UHF power LDMOS transistor BLF647
handbook, full pagewidth
MGW548
3
3
8
B2
B1
L2
L1
C9
R1
C2
+V
bias
C5
C1
C6
C7
C8
R2
R3
L16
L15
C18
C19
C16
C14
C13
C12
C11
C10
+V
D
R4
L14
C20
C15
C17
BLF647
95
80
95
Fig.12 Printed-circuit board and component layout for class-AB 800 MHz test circuit.
Dimensions in mm.
The components are situated on one side of the Rogers 5880 printed-circuit board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by through metallization.

BLF647,112

Mfr. #:
Manufacturer:
Description:
MOSFET, RF, N CHANNEL, 65V, 18A, SOT-540A-5, Drain Source Voltage Vds:65V, Continuous Drain Current Id:18A, Power Dissipation Pd:290W, Operating Frequency Min:-, Operating Frequency Max:600MHz,
Lifecycle:
New from this manufacturer.
Delivery:
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