SMF5.0AT1G Series, SZSMF5.0AT1G Series
http://onsemi.com
6
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
D
E
b
A
A1
L
c
POLARITY INDICATOR
OPTIONAL AS NEEDED
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.90 0.95 0.98 0.035
INCHES
A1 0.00 0.05 0.10 0.000
b 0.70 0.90 1.10 0.028
c 0.10 0.15 0.20 0.004
D 1.50 1.65 1.80 0.059
E 2.50 2.70 2.90 0.098
L 0.55 0.75 0.95 0.022
0.037 0.039
0.002 0.004
0.035 0.043
0.006 0.008
0.065 0.071
0.106 0.114
0.030 0.037
NOM MAX
3.40 3.60 3.80 0.134 0.142 0.150
H
E
− −
0° 8° 0° 8°
q
q
q
TOP VIEW
BOTTOM VIEW
SIDE VIEW
H
E
2X
2X
END VIEW
RECOMMENDED
DIMENSIONS: MILLIMETERS
1.25
2X
4.20
1.22
2X
12
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