ICS524
LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER
IDT™ / ICS™
LOW SKEW 1 TO 4 CLOCK BUFFER 5
ICS524 REV C 021909
AC Electrical Characteristics
VDD = 2.5 V ±5%, Ambient Temperature -40 to +85° C, unless stated otherwise
VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C, unless stated otherwise
VDD = 5 V ±5%, Ambient Temperature -40 to +85° C, unless stated otherwise
Notes: 1. With rail to rail input clock
2. Between any 2 outputs with equal loading.
3. Duty cycle on outputs will match incoming clock duty cycle. Consult IDT for tight duty cycle clock
generators.
Thermal Characteristics
Parameter Symbol Conditions Min. Typ. Max. Units
Input Frequency 0 200 MHz
Output Rise Time t
OR
0.8 to 2.0 V, C
L
=15 pF 1.0 1.5 ns
Output Fall Time t
OF
2.0 to 0.8 V, C
L
=15 pF 1.0 1.5 ns
Propagation Delay Note 1 2.2 3 5 ns
Output to Output Skew Note 2 Rising edges at VDD/2 0 50 ps
Device to Device Skew Rising edges at VDD/2 500 ps
Parameter Symbol Conditions Min. Typ. Max. Units
Input Frequency 0 200 MHz
Output Rise Time t
OR
0.8 to 2.0 V, C
L
=15 pF 0.6 1.0 ns
Output Fall Time t
OF
2.0 to 0.8 V, C
L
=15 pF 0.6 1.0 ns
Propagation Delay Note 1 2.0 2.4 4 ns
Output to Output Skew Note 2 Rising edges at VDD/2 0 50 ps
Device to Device Skew Rising edges at VDD/2 500 ps
Parameter Symbol Conditions Min. Typ. Max. Units
Input Frequency 0 200 MHz
Output Rise Time t
OR
0.8 to 2.0 V, C
L
=15 pF 0.3 0.7 ns
Output Fall Time t
OF
2.0 to 0.8 V, C
L
=15 pF 0.3 0.7 ns
Propagation Delay Note 1 1.8 2.5 4 ns
Output to Output Skew Note 2 Rising edges at VDD/2 0 50 ps
Device to Device Skew Rising edges at VDD/2 500 ps
Parameter Symbol Conditions Min. Typ. Max. Units
Thermal Resistance Junction to
Ambient
θ
JA
Still air 150 ° C/W
θ
JA
1 m/s air flow 140 ° C/W
θ
JA
3 m/s air flow 120 ° C/W
Thermal Resistance Junction to Case θ
JC
40 ° C/W
