MAX2057
1300MHz to 2700MHz Variable-Gain
Amplifier with Analog Gain Control
_______________________________________________________________________________________ 9
Pin Description
PIN NAME FUNCTION
1, 3, 4, 6, 7,
9, 10, 12,
14, 18, 19,
21–24, 27,
28, 30, 31,
33, 34, 36
GND Ground. Connect to the board’s ground plane using low-inductance layout techniques.
2 OUT_A
Second-Attenuator Output. Internally matched to 50 over the operating frequency band. Connect
to IN through a DC-blocking capacitor if greater than 21dB of gain-control range is required. No
connection is required if the second attenuator is not used.
5, 13, 16,
25, 32
V
CC
Power Supply. Bypass each pin to GND with capacitors as shown in the Typical Application
Circuit. Place capacitors as close to the pin as possible.
8 IN_A
Second-Attenuator Input. Internally matched to 50 over the operating frequency band. Connect to
a 50 RF source through a DC-blocking capacitor if greater than 21dB of gain-control range is
required. No connection is required if the second attenuator is not used.
11 V
CNTL
Analog Gain-Control Input. Limit voltages applied to this pin to a 1V to 4.5V range when V
CC
is
present to ensure device reliability.
15 R
SET1
First-Stage Amplifier Bias-Current Setting. Connect to GND through a 1.2k resistor.
17 R
SET2
Second-Stage Amplifier Bias-Current Setting. Connect to GND through a 2k resistor.
20 OUT
RF Output. Internally matched to 50 over the operating frequency band. Requires a DC-blocking
capacitor and a shunt-matching capacitor.
26 AMP_IN
Amplifier Input. Internally matched to 50 over the operating frequency band. Connect to
ATTN_OUT through a DC-blocking capacitor.
29 ATTN_OUT
Attenuator Output. Internally matched to 50 over the operating frequency band. Connect to
AMP_IN through a DC-blocking capacitor.
35 IN
RF Input. Internally matched to 50 over the operating frequency band. Connect to a 50 RF
source through a DC-blocking capacitor if the second attenuator is not used.
— EP
Exposed Pad. This pad affects RF performance and provides heat dissipation. This pad MUST be
soldered evenly to the board’s ground plane for proper operation.