CY8C21312, CY8C21512
Document Number: 001-63745 Rev. *D Page 22 of 37
AC I
2
C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V
and –40 C T
A
85 C or 3.0 V to 3.6 V and –40 C T
A
85 C, respectively. Typical parameters apply to 5 V or 3.3 V at 25 C
and are for design guidance only.
Figure 8. Definition for Timing for Fast/Standard Mode on the I
2
C Bus
Table 19. AC Characteristics of the I
2
C SDA and SCL Pins
Symbol Description
Standard Mode Fast Mode
Units Notes
Min Max Min Max
F
SCLI2C
SCL clock frequency 0 100
[17]
0400
[17]
kHz
t
HDSTAI2C
Hold time (repeated) START condition.
After this period, the first clock pulse is
generated.
4.0 –0.6 s
t
LOWI2C
LOW period of the SCL clock 4.7 –1.3 s
t
HIGHI2C
HIGH period of the SCL clock 4.0 –0.6 s
t
SUSTAI2C
Setup time for a repeated START condition 4.7 –0.6 s
t
HDDATI2C
Data hold time 0 –0 s
t
SUDATI2C
Data setup time 250 –100
[18]
–ns
t
SUSTOI2C
Setup time for STOP condition 4.0 –0.6 s
t
BUFI2C
Bus free time between a STOP and START
condition
4.7 –1.3 s
t
SPI2C
Pulse width of spikes are suppressed by the
input filter.
–050ns
I2C_SDA
I2C_SCL
S
Sr
SP
T
BUFI2C
T
SPI2C
T
SUSTOI2C
T
SUSTAI2C
T
LOWI2C
T
HIGHI2C
T
HDDATI2C
T
HDSTAI2C
T
SUDATI2C
START Condition Repeated START Condition
STOP Condition
Notes
17. F
SCLI2C
is derived from SysClk of the PSoC. This specification assumes that SysClk is operating at 24 MHz, nominal. If SysClk is at a lower frequency, then the
F
SCLI2C
specification adjusts accordingly
18. A Fast-Mode I
2
C-bus device can be used in a Standard-Mode I
2
C-bus system, but the requirement t
SUDATI2C
250 ns must then be met. This is automatically the
case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit
to the SDA line t
rmax
+t
SUDATI2C
= 1000 + 250 = 1250 ns (according to the Standard-Mode I
2
C-bus specification) before the SCL line is released.
CY8C21312, CY8C21512
Document Number: 001-63745 Rev. *D Page 23 of 37
Packaging Information
This section illustrates the packaging specifications for the CY8C21x12 PSoC device, along with the thermal impedances for each
package.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of
the emulation tools' dimensions, refer to the emulator pod drawings at http://www.cypress.com.
Packaging Dimensions
Figure 9. 20-Pin (210-Mil) SSOP
51-85077 *E
CY8C21312, CY8C21512
Document Number: 001-63745 Rev. *D Page 24 of 37
Figure 10. 28-Pin (210-Mil) SSOP
Thermal Impedances Solder Reflow Specifications
Table 21 shows the solder reflow temperature limits that must
not be exceeded.
51-85079 *E
Table 20. Thermal Impedances per Package
Package Typical
JA
[19]
Typical
JC
20-Pin SSOP 117 C/W 41 C/W
28-Pin SSOP 96 C/W 39 C/W
Table 21. Solder Reflow Specifications
Package
Maximum Peak
Temperature (T
C
)
Maximum Time
above T
C
– 5 °C
20-Pin SSOP 260 C 30 seconds
28-Pin SSOP 260 C 30 seconds
Note
19. T
J
= T
A
+ Power x
JA

CY8C21312-24PVXAT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
8-bit Microcontrollers - MCU 16 I/O 8K FLASH 512 BYTES SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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