www.irf.com 9
iP2001PbF
0.15 [.006]
C
0.12 [.005]
C
11.00
[.433]
2. DIMENS IONS AR E S HOWN IN MILLIME T E RS [INCHES ].
3. CONT ROLLING DIMENSION: MIL L IMETER
1. DIMENS IONING & TOLERANCING PER AS ME Y14.5M-1994.
NOT ES :
(4X 1.1 [.043])
B
11.00
[.433]
A
0.15 [.006]
C
0.40
[.016]
0.80
[.032]
4X
22X
0.15 [.006] C A B
0.08 [.003] C
133X Ø
0.55 [.0216]
0.45 [.0178]
2X
2X
2.66 [.1047]
2.46 [.0969]
TOP VIEW
BOTTOM VIEW
SIDE VIEW
3.11 [.1224]
2.81 [.1107]
C
0.45 [.0177]
0.35 [.0138]
PACKAGE BODY.
BALL DIAMETER, IN A PLANE PARALLEL TO DATUM C.
SPHERICAL CROWNS OF THE S OLDER B ALLS .
4. S OL DER B ALL POS IT ION DE S IGNAT ION PE R JES D 95-1, S PP-010.
7 SOLDER BALL DIAMETER IS MEASURED AT THE MAXIMUM SOLDER
5 PRIMARY DAT UM C (SEAT ING PLANE) IS DEFINED BY THE
6 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE
7
5
6
6
BALL A1
COR NE R ID
Fig. 10: Mechanical Drawing
Refer to the following application notes for detailed guidelines and suggestions when
implementing iP0WIR Technology products:
AN-1028: Recommended Design, Integration and Rework Guidelines for International Rectifiers BGA
and LGA Packages
This paper discusses optimization of the layout design for mounting iPowIR BGA and LGA packages on printed
circuit boards, accounting for thermal and electrical performance and assembly considerations . Topics
discussed includes PCB layout placement, routing, and via interconnect suggestions, as well as soldering, pick
and place, reflow, cleaning and reworking recommendations.
AN-1029: Optimizing a PCB Layout for an iPOWIR Technology Design
This paper describes how to optimize the PCB layout design for both thermal and electrical performance.
This includes placement, routing, and via interconnect suggestions.
AN-1030: Applying iPOWIR Products in Your Thermal Environment
This paper explains how to use the Power Loss and SOA curves in the data sheet to validate if the
operating conditions and thermal environment are within the Safe Operating Area of the iPOWIR product.
