D2TO035CR0680FTE3

D2TO35
www.vishay.com
Vishay Sfernice
Revision: 15-Mar-13
1
Document Number: 51058
For technical questions, contact: sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Surface Mount Power Resistor
Thick Film Technology
FEATURES
AEC-Q200 qualified
35 W at 25 °C case temperature
Surface mounted resistor - TO-263 (D
2
PAK) style
package
Wide resistance range from 0.01 W to 550 kW
•Non inductive
Resistor isolated from metal tab
Solder reflow secure at 270 °C/10 s
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Notes
For the asssembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
Power dissipation is 3.3 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 standard, 70 μm
of copper, 39 mm x 30 mm x 1.6 mm
DIMENSIONS in millimeters
STANDARD ELECTRICAL SPECIFICATIONS
MODEL SIZE
RESISTANCE
RANGE
RATED POWER
P
25 °C
W
LIMITING ELEMENT
VOLTAGE U
L
V
TOLERANCE
± %
TEMPERATURE
COEFFICIENT
± ppm/°C
CRITICAL
RESISTANCE
D2TO35 TO-263 0.01 to 550K 35 500 1, 2, 5, 10 150, 250, 700, 1100 7.14K
10.5
1.6
8.8
1.6
Tolerance: ± 0.3 mm
11.00
1.50
6.50
4.02
4.00
2.40
8.00
2.49
0.26
Footprint recommendation for
solderable contact area:
1.25
4.5
2.8
2.2
0.3
2
5.08
7.6
7.8 min.
8.7
0.2
5
15.4
8.1
5.15 1.25
10.1
MECHANICAL SPECIFICATIONS
Mechanical Protection Molded
Resistive Element Thick film
Substrate Alumina
Connections Tinned copper
Weight 2.2 g max.
ENVIRONMENTAL SPECIFICATIONS
Temperature Range - 55 °C to 175 °C
Flammability
IEC 60695-11-5
2 applications 30 s
separated by 60 s
TECHNICAL SPECIFICATIONS
Power Rating and
Thermal Resistance
of the Component
350 W at 25 °C (case
temperature)
R
TH (j - c)
: 4.28 °C/W
Temperature Coefficient See Special Feature table
Standard ± 150 ppm/°C
Dielectric Strength
IEC 60115-1
2000 V
RMS
- 1 min - 10 mA max.
(between terminals and board)
Insulation Resistance 10
6
M
Inductance 0.1 μH
DIMENSIONS
Standard Package
TO-263 style
(D
2
PAK)
D2TO35
www.vishay.com
Vishay Sfernice
Revision: 15-Mar-13
2
Document Number: 51058
For technical questions, contact: sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SPECIAL FEATURES
Resistance Values 0.010 0.045 0.1 0.5
Tolerances ± 1 % at ± 10 %
Requirement Temperature Coefficient (TCR)
(- 55 °C + 150 °C)
IEC 60115-1
± 1100 ppm/°C ± 700 ppm/°C ± 250 ppm/°C ± 150 ppm/°C
PERFORMANCE
TESTS CONDITIONS REQUIREMENTS
Momentary Overload
IEC 60115-1 §4.13
1.7 Pr 5 s for R < 2
1.4 Pr 5 s for R 2
US < 1.5 UL
± (0.25 % + 0.005 )
Load Life
IEC 60115-1
1000 h, 90/30 Pr at + 25 °C
± (1 % + 0.005 )
High Temperature Exposure
AEC-Q200 REV C conditions:
MIL-STD-202 method 108
1000 h, + 175 °C, unpowered
± (0.25 % + 0.005 )
Temperature Cycling
Pre-conditioning 3 reflows according
JESTD020D
IEC 60068-2-14 test Na
1000 cycles, - 55 °C, + 175 °C
Dwell time - 15 min
± (0.5 % + 0.005 )
Moisture Resistance
AEC-Q200 REV C conditions:
MIL-STD-202 method 106
10 cycles, 24 h, unpowered
± (0.5 % + 0.005 )
Biased Humidity
AEC-Q200 REV C conditions:
MIL-STD-202 method 103
1000 h, 85 °C, 85% RH
± (1 % + 0.005 )
Operational Life
AEC-Q200 REV C conditions:
Pre-conditioning 3 reflows according
JESTD020D
MIL-STD-202 method 108
1000 h, 90/30, powered, + 125 °C
± (1 % + 0.005 )
ESD Human Body Model
AEC-Q200 REV C conditions:
AEC-Q200-002
25 kV
AD
± (0.5 % + 0.005 )
Vibration
AEC-Q200 REV C conditions:
MIL-STD-202 method 204
5 g’s for 20 min, 12 cycles
test from 10 Hz to 2000 Hz
± (0.5 % + 0.005 )
Mechanical Shock
AEC-Q200 REV C conditions:
MIL-STD-202 method 213
100 g’s, 6 ms, 3.75 m/s
3 shocks/direction
± (0.5 % + 0.005 )
Board Flex
AEC-Q200 REV C conditions:
AEC-Q200-005
bending 2 mm, 60 s
± (0.25 % + 0.01 )
Terminal Strength
AEC-Q200 REV C conditions:
AEC-Q200-006
1.8 kgf, 60 s
± (0.25 % + 0.01 )
ASSEMBLY SPECIFICATIONS
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
TESTS CONDITIONS REQUIREMENTS
Resistance to Soldering Heat
IEC 60115-1
IEC 60068-2-58
Solder bath method: 270 °C/10 s
± (0.5 % + 0.005 )
Moisture Sensitivity Level (MSL)
IPC/JEDEC J-STD-020C
85 °C/85 % RH/168 h
Level: 1
+ pass requirements of TCR
overload and dielectic strength after MSL
D2TO35
www.vishay.com
Vishay Sfernice
Revision: 15-Mar-13
3
Document Number: 51058
For technical questions, contact: sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CHOICE OF THE BOARD
The user must choose the board according to the working conditions of the component (power, room temperature). Maximum
working temperature must not exeed 175 °C. The dissipated power is simply calculated by the following ratio:
P: Expressed in W
T: Difference between maximum working temperature and room temperature or fluid cooling temperature
R
TH (j - c)
: Thermal resistance value measured between resistive layer and outer side of the resistor. It is the thermal resistance
of the component: 4.28 °C/W.
R
TH (c - h)
: Thermal resistance value measure 4.28 °C/W. Outer side of the resistor and upper side of the board. This is the
thermal resistance of the solder layer.
R
TH (h - a)
: Thermal resistance of the board.
Example:
R
TH (c - h)
+ R
TH (h - a)
for D2TO35 power rating 3.5 W at ambient temperature + 25 °C.
Thermal resistance R
TH (j - c)
: 4.28 °C/W
Considering equation (1) we have:
T = 175 °C - 25 °C = 150 °C
R
TH (j - c)
+ R
TH (c - h)
+ R
TH (h - a)
= T/P = 150/3.5 = 42.8 °C/W
R
TH (c - h)
+ R
TH (h - a)
= 42.8 °C/W - 4.28 °C/W = 38.52 °C/W
Single Pulse
:
These informations are for a single pulse on a cold resistor at 25 °C (not already used for a dissipation) and for pulses of
100 ms maximum duration.
The formula used to calculate E is:
with:
E (J): Pulse energy
P (W): Pulse power
t (s): Pulse duration
U (V): Pulse voltage
R (W): Resistor
The energy calculated must be less: than that allowed by the graph.
Repetitive or Superimposed Pulses
:
The following formula is used to calculate the “equivalent” energy of a repetitive pulse or the “equivalent energy” of a pulse on
a resistor that is already dissipating power.
with:
E
c
(J): Equivalent pulse energy
E (J): Known pulse energy
P
r
: Resistor power rating
P
a
: Mean power being dissipated
The energy calculated must be less than that allowed by the graph and the average power dissipated (P
a
) must not exceed the
continuous power of resistor.
P
T
R
TH (j - c)
R
TH (c - h)
R
TH (h - a)
++
---------------------------------------------------------------------------------------------------
1
=
E P x t
U
2
R
--------
x t==
E
c
E x 1
P
a
P
r
------
+


=

D2TO035CR0680FTE3

Mfr. #:
Manufacturer:
Vishay
Description:
Thick Film Resistors - SMD 35W 0.068ohm 1%
Lifecycle:
New from this manufacturer.
Delivery:
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