LTC3770
19
3770fc
oscillators are identical. At this stable operating point the
phase comparator output is open and the fi lter capacitor
C
LP
holds the voltage. The LTC3770 PLLIN pin must be
driven from a low impedance source such as a logic gate
located close to the pin.
The loop fi lter components (C
LP
, R
LP
) smooth out the
current pulses from the phase detector and provide a
stable input to the voltage controlled oscillator. The fi lter
components C
LP
and R
LP
determine how fast the loop
acquires lock. Typically R
LP
=10kΩ and C
LP
is 0.01μF to
0.1μF.
Dead Time Control
To further optimize the effi ciency, the LTC3770 gives us-
ers some control over the dead time of the Top gate low
and Bottom gate high transition. By applying a DC voltage
on the Z0 pin, the TG low BG high dead time can be pro-
grammed. Because the dead time is a strong function of
the load current and the type of MOSFET used, users need
to be careful to optimize the dead time for their particular
applications. Figure 11 shows the relation between the TG
Low BG High Dead time by varying the Z0 voltages. For
an application using LTC3770 with load current of 5A and
IR7811W MOSFETs, the dead time could be optimized. To
make sure that there is no shoot-through under all condi-
tions, a dead time of 70ns is selected. This corresponds to
a DC voltage about 2.6V on Z0 pin. This voltage can easily
be generated with a resistor divider off INTV
CC
.
APPLICATIONS INFORMATION
Effi ciency Considerations
The percent effi ciency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the effi ciency and which change would
produce the most improvement. Although all dissipative
elements in the circuit produce losses, four main sources
account for most of the losses in LTC3770 circuits:
1. DC I
2
R losses. These arise from the resistances of the
MOSFETs, inductor and PC board traces and cause the
effi ciency to drop at high output currents. In continuous
mode the average output current fl ows through L, but is
chopped between the top and bottom MOSFETs. If the two
MOSFETs have approximately the same R
DS(ON)
, then the
resistance of one MOSFET can simply be summed with
the resistances of L and the board traces to obtain the
DC I
2
R loss. For example, if R
DS(ON)
= 0.01Ω and R
L
=
0.005Ω, the loss will range from 15mW to 1.5W as the
output current varies from 1A to 10A.
2. Transition loss. This loss arises from the brief amount
of time the top MOSFET spends in the saturated region
during switch node transitions. It depends upon the
input voltage, load current, driver strength and MOSFET
capacitance, among other factors. The loss is signifi cant
at input voltages above 20V and can be estimated from:
Transition Loss (1.7A
–1
) V
IN
2
I
OUT
C
RSS
f
3. INTV
CC
current. This is the sum of the MOSFET driver
and control currents.
4. C
IN
loss. The input capacitor has the diffi cult job of
ltering the large RMS input current to the regulator. It
must have a very low ESR to minimize the AC I
2
R loss and
suffi cient capacitance to prevent the RMS current from
causing additional upstream losses in fuses or batteries.
Other losses, including C
OUT
ESR loss, Schottky diode D1
conduction loss during dead time and inductor core loss
generally account for less than 2% additional loss.
When making adjustments to improve effi ciency, the
input current is the best indicator of changes in effi ciency.
Figure 11. TG Low BG High Dead Time vs Z0 Voltage
Z0 VOLTAGE (V)
0
TDEAD TIME (ns)
60
100
120
140
5
3770 F11
20
80
160
40
–20
0
1
2
43
180
I
OUT
= 5A
IR7811W FETs
LTC3770
20
3770fc
If you make a change and the input current decreases, then
the effi ciency has increased. If there is no change in input
current, then there is no change in effi ciency.
Checking Transient Response
The regulator loop response can be checked by looking
at the load transient response. Switching regulators
take several cycles to respond to a step in load current.
When a load step occurs, V
OUT
immediately shifts by an
amount equal to ΔI
LOAD
(ESR), where ESR is the effective
series resistance of C
OUT
. ΔI
LOAD
also begins to charge or
discharge C
OUT
generating a feedback error signal used
by the regulator to return V
OUT
to its steady-state value.
During this recovery time, V
OUT
can be monitored for
overshoot or ringing that would indicate a stability problem.
The I
TH
pin external components shown in Figure 12 will
provide adequate compensation for most applications. For
a detailed explanation of switching control loop theory see
Application Note 76.
Design Example
As a design example, take a supply with the following
specifi cations: V
IN
= 5V to 28V (15V nominal), V
OUT
=
2.5V ±5%, I
OUT(MAX)
= 10A, f = 450kHz. First, calculate
the timing resistor with V
ON
= V
OUT
:
R
V
V kHz pF
k
ON
=
()( )()
25
3 2 5 450 10
74
.
.
and choose the inductor for about 40% ripple current at
the maximum V
IN
:
L
V
kHz A
V
V
=
()()()
=
25
450 0 4 10
1
25
28
13
.
.
.
. μμH
Selecting a standard value of 1.8μH results in a maximum
ripple current of:
Δ
μ
I
V
kHz H
V
V
A
L
=
()()
=
25
450 1 8
1
25
28
28
.
.
.
.
Next, choose the synchronous MOSFET switch. Choosing
a Si4874 (R
DS(ON)
= 0.0083Ω (NOM) 0.010Ω (MAX),
θ
JA
= 40°C/W) yields a nominal sense voltage of:
V
SNS(NOM)
= (10A)(1.3)(0.0083Ω) = 108mV
APPLICATIONS INFORMATION
Tying V
RNG
to 1.1V will set the current sense voltage range
for a nominal value of 110mV with current limit occurring
at 146mV. To check if the current limit is acceptable,
assume a junction temperature of about 80°C above a
70°C ambient with ρ
150°C
= 1.5:
I
mV
AA
LIMIT
()
Ω
()
+
()
=
146
15 0010
1
2
28 11
..
.
and double check the assumed T
J
in the MOSFET:
P
VV
V
AW
BOT
=
()()
Ω
()
=
28 2 5
28
11 15 0010 165
2
–.
.. .
T
J
= 70°C + (1.65W)(40°C/W) = 136°C
Because the top MOSFET is on for such a short time, an
Si4884 R
DS(ON)(MAX)
= 0.0165Ω, C
RSS
= 100pF, θ
JA
=
40°C/W will be suffi cient. Checking its power dissipation
at current limit with ρ
100°C
= 1.4:
P
V
V
A
V
TOP
=
()()
Ω
()
+
()( )
25
28
11 1 4 0 0165
17 28
2
.
..
.
22
11 100 250
025 037 062
ApFkHz
WWW
()( )( )
=+=...
T
J
= 70°C + (0.62W)(40°C/W) = 95°C
The junction temperature will be signifi cantly less at
nominal current, but this analysis shows that careful at-
tention to heat sinking on the board will be necessary in
this circuit.
C
IN
is chosen for an RMS current rating of about 3A at 85°C.
The output capacitors are chosen for a low ESR of 0.013Ω
to minimize output voltage changes due to inductor ripple
current and load steps. The ripple voltage will be only:
ΔV
OUT(RIPPLE)
=ΔI
L(MAX)
(ESR)
= (2.8A) (0.013Ω) = 36mV
However, a 0A to 10A load step will cause an output
change of up to:
ΔV
OUT(STEP)
= ΔI
LOAD
(ESR) = (10A) (0.013Ω) = 130mV
An optional 22μF ceramic output capacitor is included
to minimize the effect of ESL in the output ripple. The
complete circuit is shown in Figure 12.
LTC3770
21
3770fc
To set a ±25% margining, select the resistors R3, R4
such that:
V
or
REFIN
=
06 25 06
118 3
4
25 0 6
.%.
.•
%• .
R
R
RR483
Choose R3 to be 10k, R4 to be 82k for this application.
PC Board Layout Checklist
When laying out a PC board follow one of two suggested
approaches. The simple PC board layout requires a
dedicated ground plane layer. Also, for higher currents,
it is recommended to use a multilayer board to help with
heat sinking power components.
The ground plane layer should not have any traces and
APPLICATIONS INFORMATION
it should be as close as possible to the layer with power
MOSFETs.
• Place C
IN
, C
OUT
, MOSFETs, D1 and inductor all in one
compact area. It may help to have some components
on the bottom side of the board.
Use an immediate via to connect the components to
ground plane including SGND and PGND of LTC3770.
Use several bigger vias for power components.
Use compact plane for switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
Use planes for V
IN
and V
OUT
to maintain good voltage
ltering and to keep power losses low.
Flood all unused areas on all layers with copper. Flooding
with copper will reduce the temperature rise of power
component. You can connect the copper areas to any
DC net (V
IN
, V
OUT
, GND or to any other DC rail in your
system).
Figure 12. Design Example: 2.5V/10A at 450kHz
3770 F12
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
RUN
V
ON
PGOOD
V
RNG
V
FB
I
TH
SGND
MARGIN1
MARGIN0
I
ON
V
REFIN
V
REFOUT
MPGM
TRACK/SS
RUN FCB
Z0
BOOST
TG
SW
PGND
BG
INTV
CC
Z1
Z2
Z
VIN
V
IN
PLLIN
PLLFLTR
INTV
CC
5V
LTC3770EG
L1: SUMIDA CEP125-1R8MC-H
C
OUT
: CORNELL DUBILIER ESRE181E04B
C
IN
: UNITED CHEMICON THCR60E1H106ZT
R6
11k
R5
39k
R
C
20k
R3
10k
R2
95.3k
R
ON
75k
R4
82k
R
PG
100k
CC1
500pF
CC2
100pF
C
SS
0.1μF
CV
CC
4.7μF
CV
IN
0.1μF
DB
CMDSH-3
D1
B340A
+
C
OUT3
23μF
x5R
x2
C
OUT1-2
180μF
4V
x2
V
OUT
2.5V
10A
V
IN
5V TO 28V
+
C
IN
10μF
50V
x3
CB
0.22μF
M1
Si4884
L1
1.8μH
M2
Si4874
+
R1
30.1k
R8
51k
R7
47k

LTC3770EG#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Fast Synch Controller w/ Margining, Tracking, PLL
Lifecycle:
New from this manufacturer.
Delivery:
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