MMA1210D

Motorola Sensor Device Data MMA1210D
7
PACKAGE DIMENSIONS
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection
interface between the board and the package. With the
correct footprint, the packages will self-align when subjected
to a solder reflow process. It is always recommended to
design boards with a
solder mask layer to avoid bridging and shorting
between solder pads.
Figure 6. Footprint SOIC-16 (Case 475-01)
DATE 05/17/01
CASE 475-01
ISSUE B
C
K
SEATING
PLANE
T
0.1
18
16 9
P
2 PLACES, 16 TIPS
D
16X
A0.15 BT
A
M
0.13 BT
A
B
A
B
G
G/2
MILLIMETERS
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
10.15
7.40
3.30
0.35
0.76
0.25
0.10
10.16
0.25
MAX
10.45
7.60
3.55
0.49
1.14
1.27 BSC
0.32
0.25
10.67
0.75
R
X 45˚
J
F
M
NOTES:
1.
2.
3.
4.
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
DIMENSIONS "A" AND "B" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
PER SIDE.
DIMENSION "D" DOES NOT INCLUDE DAMBAR
PROTRUSION. PROTRUSIONS SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.75.
CASE 475-01
ISSUE B
16 LEAD SOIC
0.380 in.
9.65 mm
0.050 in.
1.27 mm
0.024 in.
0.610 mm
0.080 in.
2.03 mm
Fr
eescale S
emiconduct
or
, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...
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HOME PAGE: http://motorola.com/semiconductors
MMA1210D
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© Motorola, Inc. 2004
Fr
eescale S
emiconduct
or
, I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
nc...

MMA1210D

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Accelerometers 4.75-5.25 VOLT
Lifecycle:
New from this manufacturer.
Delivery:
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