NL3S22S
www.onsemi.com
9
PACKAGE DIMENSIONS
UQFN10 1.4x1.8, 0.4P
CASE 488AT
ISSUE A
MOUNTING FOOTPRINT*
10 X
PITCH
1
9 X
SCALE 20:1
0.663
0.0261
0.200
0.0079
0.400
0.0157
0.225
0.0089
2.100
0.0827
1.700
0.0669
0.563
0.0221
ǒ
mm
inches
Ǔ
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
A
b
A1
0.05
C
SEATING
PLANE
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A
1.40 BSC
A1
0.40 BSC
0.45 0.60
b
D
0.30 0.50
E
e
L
L1
0.00 0.05
PIN 1 REFERENCE
D A
E
B
0.10 C
2X
0.10 C
2X
0.05 C
C
L3
10
1
3
5
6
0.05 C
0.10
CAB
10 X
e
e/2
L9 X
0.00 0.15
1.80 BSC
0.15 0.25
10X
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L3
0.40 0.60
0.127 REFA3
TOP VIEW
SIDE VIEW
BOTTOM VIEW
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