NCP2817BFCCT2G

© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. 0
1 Publication Order Number:
NCP2817/D
NCP2817
NOCAP] LongPlay
Headphone Amplifier
NCP2817 is a dual LongPlay true ground headphone amplifier
designed for portable communication device applications such as
mobile phones. This part is capable of delivering typical 27 mW of
continuous average power into a 32 W load from a 1.8 V power supply
with a THD+N of 1%.
Based on the power supply delivered to the device, an internal
power management block generates a symmetrical positive and
negative voltage. Thus, the internal amplifiers provide outputs
referenced to Ground and the losses are reduced which helps to
increase the battery life. In this NOCAP
configuration, the two
external heavy coupling capacitors can be removed. It offers
significant space and cost savings compared to a typical stereo
application.
NCP2817 is available with internal gain of −1.5 V/V. It reaches a
superior −100 dB PSRR and noise floor. Thus, it offers high fidelity
audio sound, as well as a direct connection to the battery. It contains
circuitry to prevent from “Pop & Click” noise that would otherwise
occur during turn−on and turn−off transitions. The device is available
in 12 bump CSP package (1.62 x 1.22, 0.4P) which helps to save space
on the board.
Features
NOCAP Output Eliminates DC−Blocking Capacitors:
Saves Board Area
Saves Component Cost
No Low−Frequency Response Attenuation
LongPlay Architecture: Increase the Battery Life
High PSRR (−100 dB): Direct Connection to the Battery
High SNR Performance (100 dB)
“Pop and Click” Noise Protection Circuitry
Internal Gain (−1.5 V/V) or External Adjustable Gain
Ultra Low Current Shutdown Mode
High Impedance Mode
1.6 V − 5.5 V Operation
Thermal Overload Protection Circuitry
CSP 1.62 x 1.22, 0.4P
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
Headset Audio Amplifier for
Cellular Phones
MP3 player
Personal Digital Assistant and Portable Media Player
Portable devices
www.onsemi.com
See detailed ordering and shipping information on page 9 o
f
this data sheet.
ORDERING INFORMATION
12 PIN CSP
FC SUFFIX
CASE 499BJ
MARKING
DIAGRAM
817BC
ALYWW
G
A = Assembly Location
L = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
PIN ASSIGNMENT
A1
B1
C1
A2 A3 A4
B2 B3 B4
C2 C3 C4
CPM PVM INL INR
PGND /SD AGND SGND
CPP VP OUTL OUTR
(Top View)
12−Pin 1.2 x 1.6 mm CSP
NCP2817
www.onsemi.com
2
+
+
Pop & Click
Suppression
Biasing
Power Management
&
Charge Pump
/SD
Figure 1. Block Diagram
IN
L
IN
R
V
RM
V
RP
V
P
C
PP
C
PM
V
RP
V
RM
V
RP
V
RM
P
VM
P
GND
OUT
L
OUT
R
A
GND
S
GND
PIN FUNCTION DESCRIPTION
Pin
Pin
Name
Type Description
A1 C
PM
Input /
Output
Charge pump flying capacitor negative terminal. A 1 mF ceramic capacitor to C
PP
is required
A2 P
VM
Output
Charge pump output. A 1 mF ceramic capacitor to ground is needed
A3 IN
L
Input Left input of the audio source
A4 IN
R
Input Right input of the audio source
B1 P
GND
Ground Power ground. This pin should be connected directly to the ground plane.
B2 /SD Input Enable activation.
B4 S
GND
Ground Sense Ground. Connect to shield terminal of headphone jack or ground plane.
C1 C
PP
Input /
Output
Charge pump flying capacitor positive terminal. A 1 mF ceramic capacitor to C
PM
is required
C2 V
P
Power Positive supply voltage. Connected to single secondary cell Lithium−Ion battery or any other kind of
power supply
C3 OUT
L
Output Left audio channel output signal
C4 OUT
R
Output Right audio channel output signal
B3 A
GND
Ground Analog ground. This pin should be connected directly to the GND plane. Careful layout and no direct
connection to other ground pins are required to ensure good noise immunity
NCP2817
www.onsemi.com
3
MAXIMUM RATINGS
Rating Symbol Value Unit
V
P
Pin: Power Supply Voltage (Note 1) V
P
−0.3 to + 6.0 V
/SD Pin: Input V
mr1
−0.3 to V
P
+ 0.3 V
Human Body Model (HBM) ESD Rating are (Notes 2 and 3) ESD HBM 2000 V
Machine Model (MM) ESD Rating are (Note 2 and 3) ESD MM 200 V
CSP 1.62 x 1.22, 0.4P package (Note 6 and 7)
Thermal Resistance Junction to Case
R
q
JC
(Note 7)
°C/W
Operating Ambient Temperature Range T
A
−40 to + 85 °C
Operating Junction Temperature Range T
J
−40 to + 125 °C
Maximum Junction Temperature (Note 6) T
JMAX
+ 150 °C
Storage Temperature Range T
STG
−65 to + 150 °C
Moisture Sensitivity (Note 5) MSL Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
A
= 25°C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. The thermal shutdown set to 150 °C (typical) avoids irreversible damage on the device due to power dissipation.
7. The R
q
CA
is dependent on the PCB heat dissipation. The maximum power dissipation (P
D
) is dependent on the min input voltage, the max
output current and external components selected.
R
qCA
+
125 * T
A
P
D
* R
qJC
ELECTRICAL CHARACTERISTICS Min & Max Limits apply for T
A
between −40°C to +85°C and T
J
up to + 125°C for V
P
= 3.6 V
(Unless otherwise noted). Typical values are referenced to T
A
= + 25°C and V
P
= 3.6 V.
Symbol
Parameter Conditions Min Typ Max Unit
V
BATTERY
Supply voltage range 1.6 5.5 V
I
SD
Shutdown current 1
mA
I
Q
Quiescent current V
P
= 1.8 V 2.3 3.0 mA
R
IN
Input resistance 7.5 10 12.5
kW
R
SD
/SD pull−down resistor 300
kW
Maximum input signal swing 2.8 V
PP
V
IH
High−level input voltage SD pin 1.2 V
V
IL
Low−level input voltage SD pin 0.4 V
UVLO UVLO threshold Falling edge 1.4 V
UVLO
HYS
UVLO hysteresis 100 mV
T
SD
Thermal shutdown temperature 160 °C
V
OS
Output offset voltage Input AC grounded ± 0.5 mV
T
WU
Turning On time 1 ms
V
LP
Max Output Swing (peak value)
V
P
= 1.8 V, Headset = 32 W
1.13 V
peak
P
O
Max Output Power (Note 8) V
P
= 1.8 V, THD+N = 1%
Headset = 16 W
Headset = 32 W
20
41
27
mW
8. Guaranteed by design and characterized.
9. Typical application circuit as depicted

NCP2817BFCCT2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Audio Amplifiers HEADPHONE AMPLIFIER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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