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BD5471MUV-E2

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Technical Note
13/21
BD5471MUV
www.rohm.com
2010.06 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
●About the thermal design by the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation. Pay attention to points such as the following.
Since an maximum junction temperature (Tj
MAX
.)or operating temperature range (Topr) is shown in the absolute maximum
ratings of the IC, to reference the value, find it using the Pd-Ta characteristic (temperature derating curve).
If an input signal is too great when there is insufficient radiation, TSD (thermal shutdown) may operate. TSD, which
operates at a chip temperature of approximately +180℃, is canceled when this goes below approximately +100℃.
Since TSD operates persistently with the purpose of preventing chip damage, be aware that long-term use in the vicinity
that TSD affects decrease IC reliability.
Temperature Derating Curve
Power dissipation values vary according to the board on which the IC is mounted. The Power dissipation of this IC when
mounted on a multilayer board designed to radiate is greater than the values in the graph above.
Note) Values are actual measurements and are not guaranteed.
Reference Data
VQFN024V4040
2.5
2.0
1.0
0.5
0.0
0 25 50 75 100 125
150
Ambient temperature Ta(℃）
Power dissipation Pd(W）
①0.7W
measurement conditions
: IC unit Rohm standard board mounted
board size : 74.2mm×74.2mm×1.6mmt
board① FR4 1-layer glass epoxy board(Copper on top layer 0%)
board② FR4 4-layer glass epoxy board(Copper on 2,3 layer 100%)
board size : 35mm×25mm×1.6mmt
board③ FR4 4-layer glass epoxy board(Copper on 2,3 layer 100%)
connecting with thermal via
85
1.5
0.7
2.2
②2.2W
3.5
3.1
③3.1W
Technical Note
14/21
BD5471MUV
www.rohm.com
2010.06 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
●Typical Characteristics
TABLE OF GRAPHS
Parameter Parameter Figure
Efficiency vs Output power 1, 2
Power dissipation vs Output power 3, 4
Supply current (Iccact) vs Supply voltage 5
Supply current (Istby) vs Supply voltage 6
Supply current (Ireg) vs Supply voltage 7
Shutdown current (Isd) vs Supply voltage 8
Output power (Po)
vs Load resistance 9, 10
vs Supply voltage 11, 12
Total harmonic distortion plus noise (THD+N)
vs Output power 13, 14
vs Frequency 15, 16, 17, 18, 19, 20, 21,22
vs Common-mode input voltage 23, 24
Supply voltage rejection ratio (PSRR) vs Frequency 25, 26, 27, 28
Common-mode rejection ratio (CMRR) vs Frequency 29, 30
Gain vs Frequency 31, 32, 33, 34, 35, 36, 37, 38
Technical Note
15/21
BD5471MUV
www.rohm.com
2010.06 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
Iccreg - VDD
No load, No signal
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
VDD [V]
Iccreg [mA]
Iccsd - VDD
0
0.1
0.2
0.3
0.4
0.5
0123456
VDD [V]
Isd [uA]
Efficiency - Output power
f=1kHz RL=8Ω+33uH LC-filter(22uH+1uF)
0
10
20
30
40
50
60
70
80
90
100
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Po [W]
Efficiency [%]
VDD=2.5V
VDD=3.6V
VDD=5.0V
Icc vs Output po wer
f=1kHz RL=8Ω+33uH LC-filter(22uH+1uF)
0
50
100
150
200
250
300
350
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Po [W]
Icc [mA]
VDD=2.5V
VDD=3.6V
VDD=5.0V
Efficiency vs Output power
f=1kHz RL=4Ω+33uH LC-filter(22uH+1uF)
0
10
20
30
40
50
60
70
80
90
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Po [W]
Efficiency [%]
VDD=2.5V
VDD=3.6V
VDD=5.0V
Icc vs Output power
f=1kHz RL=4Ω+33uH LC-filter(22uH+1uF)
0
100
200
300
400
500
600
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Po [W]
Icc [mA]
VDD=2.5V
VDD=3.6V
VDD=5.0V
Icc - VDD
No load, No signal
0
1
2
3
4
5
6
0123456
VDD [V]
Icc [mA]
Iccstby - VDD
No load, No signal
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
VDD [V]
Iccstby [mA]
Fig.1
Fig.2
Fig.3
Fig.4
Fig.5 Fig.6
Fig.7
Fig.8
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BD5471MUV-E2

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Audio Amplifiers IC STEREO SP. AMP CLASS D
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