LT5525EUF#TRPBF

10
LT5525
5525f
APPLICATIO S I FOR ATIO
WUUU
through impedance-matching inductors. Each IF pin draws
about 7.5mA of supply current (15mA total). For optimum
single-ended performance, these differential outputs must
be combined externally through an IF transformer or balun.
An equivalent small-signal model for the output is shown
in Figure 10. The output impedance can be modeled as a
574 resistor (R
IF
) in parallel with a 0.7pF capacitor. For
most applications, the bond-wire inductance (0.7nH per
side) can be ignored.
The external components, C3, L2 and L3 form an imped-
ance transformation network to match the mixer output
impedance to the input impedance of transformer T2. The
values for these components can be estimated using the
equations below, along with the impedance values listed in
Table 3. As an example, at an IF frequency of 140MHz and
R
L
= 200 (using a 4:1 transformer for T2 with an external
50 load),
n = R
IF
/R
L
= 574/200 = 2.87
Q = (n – 1) = 1.368
X
C
= R
IF
/Q = 420
C = 1/(ω • X
C
) = 2.71pF
C3 = C – C
IF
= 2.01pF
X
L
= R
L
• Q = 274
L2 = L3 = X
L
/2ω = 156nH
Table 3. IF Differential Impedance (Parallel Equivalent)
FREQUENCY OUTPUT REFLECTION COEFFICIENT
(MHz) IMPEDANCE MAG ANGLE
70 575|| – j3.39k 0.840 –1.8
140 574|| – j1.67k 0.840 –3.5
240 572|| – j977 0.840 –5.9
450 561|| – j519 0.838 –11.1
750 537|| – j309 0.834 –18.6
860 525|| – j267 0.831 –21.3
1000 509|| – j229 0.829 –24.8
1250 474|| – j181 0.822 –31.3
1500 435|| – j147 0.814 –38.0
Low Cost Output Match
For low cost applications in which the required fractional
bandwidth of the IF output is less than 25%, it may be
possible to replace the output transformer with a lumped-
element network. This circuit is shown in Figure 11, where
L11, L12, C11 and C12 form a narrowband bridge balun.
These element values are selected to realize a 180° phase
shift at the desired IF frequency, and can be estimated
using the equations below. In this case, the load resis-
tance, R
L
, is 50.
LL
RR
CC
RR
IF L
IF L
11 12
11 12
1
==
==
ω
ω
I
nductor L13 or L14 provides a DC path between V
CC
and
the IF
+
pin. Only one of these inductors is required. Low
cost multilayer chip inductors are adequate for L11, L12
and L13. If L14 is used instead of L13, a larger value is
usually required, which may require the use of a wire-
wound inductor. Capacitor C13 is a DC block which can
also be used to adjust the impedance match. Capacitor
C14 is a bypass capacitor.
Figure 10. IF Output Small Signal Model
10
11
R
IF
574
5525 F10
0.7nH L3
L2
0.7nH
C
IF
0.7pF
LT5525
IF
IF
+
R
L
200
C3
Figure 11. Narrowband Bridge IF Balun
IF
+
C12
IF
OUT
50
L12
L11
C11
IF
V
CC
C13
C14
L14
OPT
L13
OPT
5525 F11
Actual component values for IF frequencies of 240MHz,
360MHz and 450MHz are listed in Table 4. Typical IF port
return loss for these examples is shown in Figure 12.
11
LT5525
5525f
APPLICATIO S I FOR ATIO
WUUU
TYPICAL APPLICATIO S
U
Evaluation Board Layouts
Top Layer Silkscreen
Top Layer Metal
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
Conversion gain and IIP3 performance with an RF fre-
quency of 1900MHz are plotted vs IF frequency in Figure
13. These results show that the usable IF bandwidth for the
lumped element balun is greater than 60MHz, assuming
tight tolerance matching components. Contact the factory
for applications assistance with this circuit.
Table 4. Component Values for Lumped Balun
IF FREQ (MHz) L11, L12 (nH) C11, C12 (pF) C13 (pF) L14 (nH)
240 100 3.9 100 560
360 68 2.7 10 270
450 56 2.2 8.2 180
Figure 12. Typical IF Return Loss
Performance with 240MHz,
360MHz and 450MHz Lumped
Element Baluns
FREQUENCY (MHz)
200
–25
RETURN LOSS (dB)
–20
–15
–10
–5
0
250
300 350 400
5525 F12
450 500
IF FREQUENCY (MHz)
200
–5
GAIN (dB), IIP3 (dBm)
0
5
10
15
20
IIP3
GAIN
250
300 350 400
5525 F13
450 500
T
A
= 25°C
f
LO
= f
RF
– f
IF
f
RF
= 1900MHz
P
LO
= –5dBm
P
RF
= –15dBm
RF FREQUENCY (MHz)
1200
10
IIP3 (dBm)
11
13
14
15
20
17
1600
2000
2200
5525 F14
12
18
19
16
1400
1800
2400
2600
240MHz
360MHz
450MHz
T
A
= 25°C
f
LO
= f
RF
– f
IF
P
LO
= –5dBm
P
RF
= –15dBm
Figure 13. Typical Gain and IIP3 vs
IF Frequency with 240MHz,
360MHz and 450MHz Lumped
Element Baluns
Figure 14. Typical IIP3 vs RF
Frequency with Lumped Element
Baluns and IF Frequencies of
240MHz, 360MHz and 450MHz
12
LT5525
5525f
© LINEAR TECHNOLOGY CORPORATION 2004
LT/TP 1004 1K • PRINTED IN THE USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
FAX: (408) 434-0507
www.linear.com
UF Package
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
U
PACKAGE DESCRIPTIO
4.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
PIN 1
TOP MARK
(NOTE 6)
0.55 ± 0.20
1615
1
2
BOTTOM VIEW—EXPOSED PAD
2.15 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.30 ± 0.05
0.65 BSC
0.200 REF
0.00 – 0.05
(UF) QFN 1103
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.72 ±0.05
0.30 ±0.05
0.65 BSC
2.15 ± 0.05
(4 SIDES)
2.90 ± 0.05
4.35 ± 0.05
PACKAGE
OUTLINE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
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LTC2234 Input

LT5525EUF#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer 2.5GHz Low Power Downconverting Mixer
Lifecycle:
New from this manufacturer.
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