Characteristics STPS20M100S
4/11 Doc ID 15521 Rev 2
Figure 8. Relative variation of thermal
impedance junction to case
versus pulse duration
Figure 9. Relative variation of thermal
impedance junction to case versus
pulse duration
Z
th(j-c)
/R
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
TO-220AB/I²PAK/D²PAK
tp(s)
Z
th(j-c)
/R
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
TO-220FPAB
tp(s)
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
Figure 11. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 12. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 13. Forward voltage drop versus
forward current (terminals 1 and 3
short circuited)
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
D²PAK
S
Cu
(cm²)
Epoxy printed board FR4, copper thickness = 35 µm)
I
R
(mA)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 102030405060708090100
T
j
=150°C
T
j
=125°C
T
j
=25°C
T
j
=100°C
T
j
=75°C
T
j
=50°C
V
R
(V)
C(pF)
100
1000
10000
1 10 100
F=1MHz
V
OSC
=30mV
RMS
T
j
=25°C
V
R
(V)
I
FM
(A)
0
5
10
15
20
25
30
35
40
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
